A method of making superabsorbent polymer material and comprising the step of providing soluble polyacrylic acid polymers. The soluble polyacrylic acid polymers have a molar percent of carbon-to-carbon double bonds of at least 0.03. The soluble polyacrylic acid polymers may be obtained from pre-existing recycled post-consumer superabsorbent polymer material, and/or from pre-existing recycled post-industrial superabsorbent polymer material. Superabsorbent polymer material obtained by the method, and absorbent articles comprising these materials are also provided.

Superabsorbent polymer material comprising cross-linked polyacrylic acid and salts thereof. The superabsorbent polymer material further comprising at least 3.0 weight-%, based on the total weight of the superabsorbent polymer material, of soluble polyacrylic acid polymers. A method for making such superabsorbent polymer materials is also disclosed.

Superabsorbent polymer material comprising cross-linked polyacrylic acid and salts thereof. The superabsorbent polymer material further comprising at least 3.0 weight-%, based on the total weight of the superabsorbent polymer material, of soluble polyacrylic acid polymers. A method for making such superabsorbent polymer materials is also disclosed.

Disclosed is the water-absorbent resin particles including a crosslinked polymer having a structural unit derived from an ethylenically unsaturated monomer including at least one compound selected from the group consisting of (meth)acrylic acid and a salt thereof, in which a proportion of (meth)acrylic acid and a salt thereof is 70 to 100 mol % with respect to a total amount of monomer units in the crosslinked polymer, and a dissolved content is 10% by mass or more and 40% by mass or less, and a dissolved content when the water-absorbent resin particles are pulverized so that a median particle size is 80 to 165 μm is 15% by mass or more and 40% by mass or less, where the dissolved contents are measured by a specific method.

Disclosed is the water-absorbent resin particles including a crosslinked polymer having a structural unit derived from an ethylenically unsaturated monomer including at least one compound selected from the group consisting of (meth)acrylic acid and a salt thereof, in which a proportion of (meth)acrylic acid and a salt thereof is 70 to 100 mol % with respect to a total amount of monomer units in the crosslinked polymer, and a dissolved content is 10% by mass or more and 40% by mass or less, and a dissolved content when the water-absorbent resin particles are pulverized so that a median particle size is 80 to 165 μm is 15% by mass or more and 40% by mass or less, where the dissolved contents are measured by a specific method.

Aqueous binder compositions for binding fibers comprise a vinyl acetate-ethylene copolymer of 60 to 94% by weight vinyl acetate, 5 to 30% by weight ethylene and 0 to 20% by weight of further ethylenically unsaturated comonomers copolymerizable therewith, polymerized in the presence of polyvinyl alcohol in aqueous medium, wherein the polymerization is carried out in the presence of a copolymer B) containing 20 to 50% by weight of monomer units derived from ethylenically unsaturated carboxamides, 20 to 50% by weight of monomer units derived from ethylenically unsaturated monocarboxylic acids, and 20 to 50% by weight of monomer units derived from ethylenically unsaturated dicarboxylic acids or anhydrides thereof.

Aqueous binder compositions for binding fibers comprise a vinyl acetate-ethylene copolymer of 60 to 94% by weight vinyl acetate, 5 to 30% by weight ethylene and 0 to 20% by weight of further ethylenically unsaturated comonomers copolymerizable therewith, polymerized in the presence of polyvinyl alcohol in aqueous medium, wherein the polymerization is carried out in the presence of a copolymer B) containing 20 to 50% by weight of monomer units derived from ethylenically unsaturated carboxamides, 20 to 50% by weight of monomer units derived from ethylenically unsaturated monocarboxylic acids, and 20 to 50% by weight of monomer units derived from ethylenically unsaturated dicarboxylic acids or anhydrides thereof.

A polymer composition comprising star macromolecules is provided. Each star macromolecule has a core and five or more arms, wherein the number of arms within a star macromolecule varies across the composition of star molecules. The arms on a star are covalently attached to the core of the star; each arm comprises one or more (co)polymer segments; and at least one arm and/or at least one segment exhibits a different solubility from at least one other arm or one other segment, respectively, in a reference liquid of interest.

A polymer composition comprising star macromolecules is provided. Each star macromolecule has a core and five or more arms, wherein the number of arms within a star macromolecule varies across the composition of star molecules. The arms on a star are covalently attached to the core of the star; each arm comprises one or more (co)polymer segments; and at least one arm and/or at least one segment exhibits a different solubility from at least one other arm or one other segment, respectively, in a reference liquid of interest.

Provided are a transfer film for a silver conductive material protective film, including a temporary support, and a photosensitive layer which is provided on the temporary support, and includes at least one selected from the group consisting of a binder polymer and a polymerizable compound, and a photopolymerization initiator, in which an amount of free chloride ions included in the photosensitive layer is 20 ppm or less, and a mass content average value of C log P values in all the binder polymer and polymerizable compound included in the photosensitive layer is 2.75 or more; a manufacturing method of a patterned silver conductive material using the transfer film for a silver conductive material protective film; a laminate including, in the following order, a substrate, a silver conductive material, and a cured resin layer, in which an amount of free chloride ions included in the cured resin layer is 20 ppm or less, and a C log P value of a cured resin component included in the cured resin layer is 2.75 or more; and a touch panel.