C08F265/10

Temperature-triggered viscosifier for treatment of a subterranean formation

Various embodiments disclosed related to methods, compositions, and systems for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include obtaining or providing a composition including a crosslinkable viscosifier polymer. The crosslinkable viscosifier polymer can include an ethylene repeating unit including a C(O)NH.sub.2 group and an ethylene repeating unit including an S(O).sub.2OR.sup.1 group, wherein the repeating units are in block, alternate, or random configuration. At each occurrence R.sup.1 can be independently selected from the group consisting of H and a counterion. The composition can also include at least one crosslinker. The method also includes placing the composition in a subterranean formation downhole.

Temperature-triggered viscosifier for treatment of a subterranean formation

Various embodiments disclosed related to methods, compositions, and systems for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include obtaining or providing a composition including a crosslinkable viscosifier polymer. The crosslinkable viscosifier polymer can include an ethylene repeating unit including a C(O)NH.sub.2 group and an ethylene repeating unit including an S(O).sub.2OR.sup.1 group, wherein the repeating units are in block, alternate, or random configuration. At each occurrence R.sup.1 can be independently selected from the group consisting of H and a counterion. The composition can also include at least one crosslinker. The method also includes placing the composition in a subterranean formation downhole.

Temperature-triggered viscosifier for treatment of a subterranean formation

Various embodiments disclosed related to methods, compositions, and systems for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include obtaining or providing a composition including a crosslinkable viscosifier polymer. The crosslinkable viscosifier polymer can include an ethylene repeating unit including a C(O)NH.sub.2 group and an ethylene repeating unit including an S(O).sub.2OR.sup.1 group, wherein the repeating units are in block, alternate, or random configuration. At each occurrence R.sup.1 can be independently selected from the group consisting of H and a counterion. The composition can also include at least one crosslinker. The method also includes placing the composition in a subterranean formation downhole.

Aqueous dispersion resin composition, resin composition for a thermal recording layer, resin composition for a protection layer, and thermal recording material

An aqueous dispersion resin composition contains a first polymer produced by polymerizing a first monomer component containing (meth)acrylamide and a second polymer produced by polymerizing a second monomer component containing a carboxy group-containing vinyl monomer, wherein at least a portion of the carboxy group in the second polymer is neutralized.

Aqueous dispersion resin composition, resin composition for a thermal recording layer, resin composition for a protection layer, and thermal recording material

An aqueous dispersion resin composition contains a first polymer produced by polymerizing a first monomer component containing (meth)acrylamide and a second polymer produced by polymerizing a second monomer component containing a carboxy group-containing vinyl monomer, wherein at least a portion of the carboxy group in the second polymer is neutralized.

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
20180373144 · 2018-12-27 ·

Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good elasticity recovery rate. The composition may be effectively used for the formation of a cured film, particularly a spacer of a display device such as a liquid crystal display and an organic electroluminescence device.

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
20180373144 · 2018-12-27 ·

Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good elasticity recovery rate. The composition may be effectively used for the formation of a cured film, particularly a spacer of a display device such as a liquid crystal display and an organic electroluminescence device.

Compositions and methods for liquid phase oligonucleotide synthesis

Embodiments of the present application relate to polymers used as polymeric polyvalent hub for liquid phase oligonucleotide synthesis. Methods for making an oligonucleotide by liquid phase oligonucleotide synthesis using the polyvalent hub are also provided.

Compositions and methods for liquid phase oligonucleotide synthesis

Embodiments of the present application relate to polymers used as polymeric polyvalent hub for liquid phase oligonucleotide synthesis. Methods for making an oligonucleotide by liquid phase oligonucleotide synthesis using the polyvalent hub are also provided.

Pressure-sensitive adhesive composition

The present invention relates to a pressure-sensitive adhesive composition, a protective film, an optical element, and a display device. A pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to the present invention can have proper high-speed and low-speed peel strengths and simultaneously can exhibit an excellent balance between the high-speed and low-speed peel strengths. The pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention exhibits a proper level of surface resistance and excellent electrostatic discharge characteristics, and has no contaminants with respect to an adherend even when the pressure-sensitive adhesive sheet is peeled from the adherend after the pressure-sensitive adhesive sheet is attached to the adherend for a long period of time. Such a pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention can be applied to various fields of applications. For example, the pressure-sensitive adhesive sheet can be used as a protective film for optical members such as polarizing plates.