The present invention relates to an acetoacetate end-capped polyol comprising at least one residue of a polyol derived from a thermoplastic polyester, a polymer comprising the end capped polyol and the uses of such end-capped polyol containing materials. The invention also relates to methods of making a polymer composition comprising the acetoacetate end-capped polyol comprising at least one residue of a polyol derived from a thermoplastic polyester.

Disclosed is a block copolymer having a first polymer block including a first primary monomer that is a 1,1-disubstituted alkene compound, wherein the first primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the first polymer block, the first polymer block covalently bonded to a second polymer block including a second primary monomer different from the first primary monomer, wherein the second primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the second polymer block. Also disclosed is a polymer comprising at least one monomer of a 1,1-disubstituted alkene compound having a weight average molecular weight of about 3000 daltons or more, wherein the polymer is substantially free of a melting temperature and is substantially free of a glass transition temperature of about 15 C. or more.

Disclosed is a block copolymer having a first polymer block including a first primary monomer that is a 1,1-disubstituted alkene compound, wherein the first primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the first polymer block, the first polymer block covalently bonded to a second polymer block including a second primary monomer different from the first primary monomer, wherein the second primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the second polymer block. Also disclosed is a polymer comprising at least one monomer of a 1,1-disubstituted alkene compound having a weight average molecular weight of about 3000 daltons or more, wherein the polymer is substantially free of a melting temperature and is substantially free of a glass transition temperature of about 15 C. or more.

Provided is a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition containing an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I):

##STR00001##

Provided is a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition containing an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I):

##STR00001##

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

Provided is a coating material composition which is capable of forming an undercoat layer for metallic vapor deposition, the layer being excellent in terms of adhesion to various bases and appearance. The actinic-ray-curable coating material composition according to the present invention comprises one or more resins A, a (meth)acrylate B, and a silane coupling agent C, wherein the resins A comprise a polymer A1 having a hydroxyl group with a hydroxyl value of 20-200 mg-KOH/g and/or an alkyd resin A2, the proportion of the resins A and that of the (meth)acrylate B are 20-60 mass % and 40-80 mass %, respectively, with respect to the total amount, which is taken as 100 mass %, of the resins A and the (meth)acrylate B, and the amount of the silane coupling agent C is 0.3-15 parts by mass per 100 parts by mass of the total amount of the resins A and the (meth)acrylate B.

Provided is a coating material composition which is capable of forming an undercoat layer for metallic vapor deposition, the layer being excellent in terms of adhesion to various bases and appearance. The actinic-ray-curable coating material composition according to the present invention comprises one or more resins A, a (meth)acrylate B, and a silane coupling agent C, wherein the resins A comprise a polymer A1 having a hydroxyl group with a hydroxyl value of 20-200 mg-KOH/g and/or an alkyd resin A2, the proportion of the resins A and that of the (meth)acrylate B are 20-60 mass % and 40-80 mass %, respectively, with respect to the total amount, which is taken as 100 mass %, of the resins A and the (meth)acrylate B, and the amount of the silane coupling agent C is 0.3-15 parts by mass per 100 parts by mass of the total amount of the resins A and the (meth)acrylate B.

The present disclosure relates to an anti-glare film including a light-transmitting substrate; and a hard coating layer containing a binder resin and particles dispersed in the binder resin, a polarizing plate, and a display apparatus including the same, wherein the particles include a first inorganic particle aggregate having an average particle diameter of 1 to 2 ?m; a second inorganic particle aggregate having an average particle diameter of 3 to 5 ?m; and organic particles in the form of primary particles having an average particle diameter of 1 to 10 ?m.