The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: ##STR00001## wherein each R.sup.1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH.sub.2—CR.sup.3═CHR.sup.2 wherein R.sup.2 and R.sup.3 each represent H or CH.sub.3, provided that at least one R.sup.1 is the group —CH.sub.2—CR.sup.3═CHR.sup.2.

The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: ##STR00001## wherein each R.sup.1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH.sub.2—CR.sup.3═CHR.sup.2 wherein R.sup.2 and R.sup.3 each represent H or CH.sub.3, provided that at least one R.sup.1 is the group —CH.sub.2—CR.sup.3═CHR.sup.2.

The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: ##STR00001## wherein each R.sup.1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH.sub.2—CR.sup.3═CHR.sup.2 wherein R.sup.2 and R.sup.3 each represent H or CH.sub.3, provided that at least one R.sup.1 is the group —CH.sub.2—CR.sup.3═CHR.sup.2.

Described are polymerizable high energy light absorbing compounds of formula I:

##STR00001##

Wherein Y, Pg, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.

Described are polymerizable high energy light absorbing compounds of formula I:

##STR00001##

Wherein Y, Pg, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.

Curable compositions contain at least one polymerizable ionic species and, when cured (for example, by photocuring), provide cured compositions which are thermoplastic and yet fragmentable by a protic liquid medium such as water. The polymerizable ionic species corresponds to Formula (I) A+B− wherein A+ is a cationic species having a cationic functional group and a first polymerizable, ethylenically unsaturated functional group; and B″ is an anionic species having an anionic functional group and a second polymerizable, ethylenically unsaturated functional group which is the same as or different from the first polymerizable, ethylenically unsaturated functional group. The curable compositions are useful for forming sacrificial or temporary articles, for example by three-dimensional printing methods.

Curable compositions contain at least one polymerizable ionic species and, when cured (for example, by photocuring), provide cured compositions which are thermoplastic and yet fragmentable by a protic liquid medium such as water. The polymerizable ionic species corresponds to Formula (I) A+B− wherein A+ is a cationic species having a cationic functional group and a first polymerizable, ethylenically unsaturated functional group; and B″ is an anionic species having an anionic functional group and a second polymerizable, ethylenically unsaturated functional group which is the same as or different from the first polymerizable, ethylenically unsaturated functional group. The curable compositions are useful for forming sacrificial or temporary articles, for example by three-dimensional printing methods.

Heat-expandable microspheres having a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a copolymer produced from a polymerizable component containing 15 to 90 wt % of acrylonitrile, 3 to 50 wt % of an acrylate ester monomer (A) represented by formula (1) shown below, and 3 to 70 wt % of a methacrylate ester monomer (B) represented by formula (2) shown below. The weight ratio of the acrylate ester monomer (A) represented by formula (1) to the methacrylate ester monomer (B) represented by formula (2) in the polymerizable component (A:B) ranges from 10:90 to 90:10:

H.sub.2C═CH—COOR.sup.1  (1)

H.sub.2C═C(CH.sub.3)—COOR.sup.2  (2).

Also disclosed are hollow particles manufactured by expanding the heat-expandable microspheres; a composition containing a base compound and the heat-expandable microspheres or the hollow particles; and a formed product manufactured by molding or applying the composition.

Heat-expandable microspheres having a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a copolymer produced from a polymerizable component containing 15 to 90 wt % of acrylonitrile, 3 to 50 wt % of an acrylate ester monomer (A) represented by formula (1) shown below, and 3 to 70 wt % of a methacrylate ester monomer (B) represented by formula (2) shown below. The weight ratio of the acrylate ester monomer (A) represented by formula (1) to the methacrylate ester monomer (B) represented by formula (2) in the polymerizable component (A:B) ranges from 10:90 to 90:10:

H.sub.2C═CH—COOR.sup.1  (1)

H.sub.2C═C(CH.sub.3)—COOR.sup.2  (2).

Also disclosed are hollow particles manufactured by expanding the heat-expandable microspheres; a composition containing a base compound and the heat-expandable microspheres or the hollow particles; and a formed product manufactured by molding or applying the composition.

Described are polymerizable high energy light absorbing compounds of formula I: ##STR00001##
Wherein Y, Pg, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.