There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

According to the present invention, a lens adhesive including a compound represented by General Formula 1 is provided.
Pol.sub.1-Sp.sub.1-L.sub.1-Ar-L.sub.2-Sp.sub.2-Pol.sub.2  (General Formula 1) In the formula, Ar is an aromatic ring group represented by General Formula 2-2 and the like. ##STR00001## In the formula, Z.sub.1 and Z.sub.2 each represent a hydrogen atom, a methyl group, and the like; A.sub.1 and A.sub.2 each represent —S— and the like; X represents C(Rz).sub.2 and the like (where Rz is a substituent, and two Rz's may form a ring); L.sub.1 and L.sub.2 each represent a single bond, —O—, —OC(═O)—, —OC(═O)O—, —OC(═O)NH—, and the like; Sp.sub.1 and Sp.sub.2 each represent a single bond or a linking group such as a linear alkylene group; Pol.sub.1 and Pol.sub.2 each represent a hydrogen atom or a polymerizable group; and a compound represented by General Formula 1 has at least one polymerizable group. Using the lens adhesive, it is possible to provide a cemented lens that is unlikely to deteriorate due to light, and an imaging module having high durability.

According to the present invention, a lens adhesive including a compound represented by General Formula 1 is provided.
Pol.sub.1-Sp.sub.1-L.sub.1-Ar-L.sub.2-Sp.sub.2-Pol.sub.2  (General Formula 1) In the formula, Ar is an aromatic ring group represented by General Formula 2-2 and the like. ##STR00001## In the formula, Z.sub.1 and Z.sub.2 each represent a hydrogen atom, a methyl group, and the like; A.sub.1 and A.sub.2 each represent —S— and the like; X represents C(Rz).sub.2 and the like (where Rz is a substituent, and two Rz's may form a ring); L.sub.1 and L.sub.2 each represent a single bond, —O—, —OC(═O)—, —OC(═O)O—, —OC(═O)NH—, and the like; Sp.sub.1 and Sp.sub.2 each represent a single bond or a linking group such as a linear alkylene group; Pol.sub.1 and Pol.sub.2 each represent a hydrogen atom or a polymerizable group; and a compound represented by General Formula 1 has at least one polymerizable group. Using the lens adhesive, it is possible to provide a cemented lens that is unlikely to deteriorate due to light, and an imaging module having high durability.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

Disclosed are styrenic polymers made by a mass or solution process, where the amount of trimer consisting of styrene and/or acrylonitrile is less than about 0.50 weight percent. Also disclosed is a method of minimizing the amount of trimer consisting of styrene and/or acrylonitrile in styrenic polymers made by a mass or solution process. The method includes the steps of lowering the temperature of the polymerization reaction mixture and including more than one initiator in the polymerization reaction mixture.

Disclosed are styrenic polymers made by a mass or solution process, where the amount of trimer consisting of styrene and/or acrylonitrile is less than about 0.50 weight percent. Also disclosed is a method of minimizing the amount of trimer consisting of styrene and/or acrylonitrile in styrenic polymers made by a mass or solution process. The method includes the steps of lowering the temperature of the polymerization reaction mixture and including more than one initiator in the polymerization reaction mixture.

Disclosed are styrenic polymers made by a mass or solution process, where the amount of trimer consisting of styrene and/or acrylonitrile is less than about 0.50 weight percent. Also disclosed is a method of minimizing the amount of trimer consisting of styrene and/or acrylonitrile in styrenic polymers made by a mass or solution process. The method includes the steps of lowering the temperature of the polymerization reaction mixture and including more than one initiator in the polymerization reaction mixture.