Patent classifications
C08F283/01
RESIN COMPOSITION, POLISHING PAD, AND METHOD FOR PRODUCING POLISHING PAD
Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
RESIN COMPOSITION, POLISHING PAD, AND METHOD FOR PRODUCING POLISHING PAD
Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
THERMOSETTING RESIN COMPOSITION
The present invention aims to provide a thermosetting resin composition that causes no environmental issues such as generation of VOCs and has curability (especially, curability at low temperature) as good as that in the case using a diallyl phthalate monomer as a crosslinking agent. The present invention reveals that the following thermosetting resin composition has excellent curability at low temperature. The thermosetting resin composition contains an unsaturated polyester resin; an alicyclic polyfunctional allyl ester represented by the following formula (1) [in the formula, n is an integer of 2 to 4 and Z is an n-valent alicyclic hydrocarbon group]; and an initiator having a one-minute half-life temperature in a range of 100 C. to 250 C. and a molecular weight of 100 to 400 and selected from the group consisting of peroxyketals, peroxyesters, dialkyl peroxides, and peroxy carbonates.
[Chem. 1]
ZCOOCH.sub.2CHCH.sub.2)(1)
THERMOSETTING RESIN COMPOSITION
The present invention aims to provide a thermosetting resin composition that causes no environmental issues such as generation of VOCs and has curability (especially, curability at low temperature) as good as that in the case using a diallyl phthalate monomer as a crosslinking agent. The present invention reveals that the following thermosetting resin composition has excellent curability at low temperature. The thermosetting resin composition contains an unsaturated polyester resin; an alicyclic polyfunctional allyl ester represented by the following formula (1) [in the formula, n is an integer of 2 to 4 and Z is an n-valent alicyclic hydrocarbon group]; and an initiator having a one-minute half-life temperature in a range of 100 C. to 250 C. and a molecular weight of 100 to 400 and selected from the group consisting of peroxyketals, peroxyesters, dialkyl peroxides, and peroxy carbonates.
[Chem. 1]
ZCOOCH.sub.2CHCH.sub.2)(1)
THERMOSETTING RESIN COMPOSITION
The present invention aims to provide a thermosetting resin composition that causes no environmental issues such as generation of VOCs and has curability (especially, curability at low temperature) as good as that in the case using a diallyl phthalate monomer as a crosslinking agent. The present invention reveals that the following thermosetting resin composition has excellent curability at low temperature. The thermosetting resin composition contains an unsaturated polyester resin; an alicyclic polyfunctional allyl ester represented by the following formula (1) [in the formula, n is an integer of 2 to 4 and Z is an n-valent alicyclic hydrocarbon group]; and an initiator having a one-minute half-life temperature in a range of 100 C. to 250 C. and a molecular weight of 100 to 400 and selected from the group consisting of peroxyketals, peroxyesters, dialkyl peroxides, and peroxy carbonates.
[Chem. 1]
ZCOOCH.sub.2CHCH.sub.2)(1)
Polymers from muconic acid isomers and its derivatives
This invention relates to polymerization of muconic acid and its derivatives. Muconic acid useful for the invention can be in any of its isomeric forms including cis, cis-muconic acid (ccMA), cis, trans-muconic acid (ctMA), and trans, trans-muconic acid (ttMA). Muconic acid used in the invention can be derived either from renewable carbon resources through biological fermentation or from non-renewable petrochemical resources through biological fermentation or chemical conversion.
Polymers from muconic acid isomers and its derivatives
This invention relates to polymerization of muconic acid and its derivatives. Muconic acid useful for the invention can be in any of its isomeric forms including cis, cis-muconic acid (ccMA), cis, trans-muconic acid (ctMA), and trans, trans-muconic acid (ttMA). Muconic acid used in the invention can be derived either from renewable carbon resources through biological fermentation or from non-renewable petrochemical resources through biological fermentation or chemical conversion.
ROSIN-MODIFIED RESIN AND METHOD FOR PRODUCING SAME, VARNISH FOR ACTIVE ENERGY RAY-CURABLE LITHOGRAPHIC INK, ACTIVE ENERGY RAY-CURABLE LITHOGRAPHIC INK, AND PRINTED PRODUCT
A rosin-modified resin having a structural unit (ab) derived from a compound obtained by addition of an ,-unsaturated carboxylic acid or acid anhydride thereof (B) to a conjugated rosin acid (A), a structural unit (c) derived from an organic monobasic acid (C) excluding the conjugated rosin acid (A), a structural unit (d) derived from an aliphatic polybasic acid anhydride (D), and a structural unit (e) derived from a polyol (E), wherein the weight ratio between the structural unit (ab) and the structural unit (c) is within a range from 100:80 to 100:350.
ROSIN-MODIFIED RESIN AND METHOD FOR PRODUCING SAME, VARNISH FOR ACTIVE ENERGY RAY-CURABLE LITHOGRAPHIC INK, ACTIVE ENERGY RAY-CURABLE LITHOGRAPHIC INK, AND PRINTED PRODUCT
A rosin-modified resin having a structural unit (ab) derived from a compound obtained by addition of an ,-unsaturated carboxylic acid or acid anhydride thereof (B) to a conjugated rosin acid (A), a structural unit (c) derived from an organic monobasic acid (C) excluding the conjugated rosin acid (A), a structural unit (d) derived from an aliphatic polybasic acid anhydride (D), and a structural unit (e) derived from a polyol (E), wherein the weight ratio between the structural unit (ab) and the structural unit (c) is within a range from 100:80 to 100:350.
Resin composition, cured product thereof, and friction stir welding method
A friction stir welding method using a resin composition including: a monomer (A) having an ethylenically unsaturated bond; a thermosetting resin (B); a radical polymerization initiator (C); and a fiber reinforcing material (D), wherein the thermosetting resin (B) is an unsaturated polyester resin or a vinyl ester resin.