A friction stir welding method using a resin composition including: a monomer (A) having an ethylenically unsaturated bond; a thermosetting resin (B); a radical polymerization initiator (C); and a fiber reinforcing material (D), wherein the thermosetting resin (B) is an unsaturated polyester resin or a vinyl ester resin.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

Disclosed are methods of forming a multiple coating on a dry plating member and a molded article manufactured using the same. The method may include applying a color coating agent onto a surface of a plating layer of a plating member and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and curing the applied clear coating agent to form a clear layer, wherein the plating member includes a substrate, an undercoat layer formed on a surface of at least a part of the substrate, and a plating layer formed on a surface of the undercoat layer.

Disclosed are methods of forming a multiple coating on a dry plating member and a molded article manufactured using the same. The method may include applying a color coating agent onto a surface of a plating layer of a plating member and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and curing the applied clear coating agent to form a clear layer, wherein the plating member includes a substrate, an undercoat layer formed on a surface of at least a part of the substrate, and a plating layer formed on a surface of the undercoat layer.

Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):

##STR00001##

(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C.sub.1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the O group in formula (1); and R.sup.1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent. ##STR00001##

A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C.sub.1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the O group in formula (1); and R.sup.1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent. ##STR00001##

The present invention relates to a curable resin composition. More specifically, the present invention relates to a composition comprising methylene malonate functional reactive resin, to its preparation methods, and to the use of the composition in the construction field.