Patent classifications
C08F283/01
Acrylic-modified alkyd resin and coating material for priming for thin inorganic film
Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential components: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure. Also provided are a curable composition, a coating material for undercoating for a thin inorganic film, and a molded body including an undercoat layer including the coating material for undercoating for a thin inorganic film.
Acrylic-modified alkyd resin and coating material for priming for thin inorganic film
Provided are a coating material that is for undercoating for a thin inorganic film, has excellent adhesiveness to various base materials, and produces no appearance change or no peeling off even under high-temperature conditions, and an acrylic-modified alkyd resin as a raw material for such a coating material. The acrylic-modified alkyd resin includes a copolymer including as essential components: an alkyd resin (A) having an unsaturated bond in a molecular structure; and a polymerizable monomer (B) having an unsaturated bond in a molecular structure. Also provided are a curable composition, a coating material for undercoating for a thin inorganic film, and a molded body including an undercoat layer including the coating material for undercoating for a thin inorganic film.
Thermosetting resin composition
A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: ##STR00001##
(wherein A.sup.1 is a C.sub.2 or C.sub.3 alkenyl group or alkynyl group, and A.sup.2 is a C.sub.2 alkenylene group or alkynylene group).
Thermosetting resin composition
A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: ##STR00001##
(wherein A.sup.1 is a C.sub.2 or C.sub.3 alkenyl group or alkynyl group, and A.sup.2 is a C.sub.2 alkenylene group or alkynylene group).
Thermosetting resin composition
A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: ##STR00001##
(wherein A.sup.1 is a C.sub.2 or C.sub.3 alkenyl group or alkynyl group, and A.sup.2 is a C.sub.2 alkenylene group or alkynylene group).
ADHESION PROMOTING COMPOSITIONS AND METHOD OF IMPROVING FUEL RESISTANCE OF A COATED ARTICLE
The present invention is directed to solventborne film-forming compositions comprising: a) a non-chlorinated, linear polyolefin polymer prepared from a reaction mixture comprising 0.5 to 5 percent by weight maleic anhydride based on the total weight of monomers in the reaction mixture; b) an aminoplast: and c) a polymer component comprising: i) an addition polymer prepared from a reaction mixture comprising coumarone; and/or ii) an alkyd resin. The present invention is also drawn to methods of improving fuel resistance of a coated article, comprising: (1) applying the solventborne film-forming composition above to a substrate to form a coated substrate; (2) applying a curable film-forming composition to at least a portion of the coated substrate formed in step (1) to form a multi-layer coated substrate; and (3) heating the multi-layer coated substrate formed in step (2) to a temperature and for a time sufficient to cure the film-forming composition.
ADHESION PROMOTING COMPOSITIONS AND METHOD OF IMPROVING FUEL RESISTANCE OF A COATED ARTICLE
The present invention is directed to solventborne film-forming compositions comprising: a) a non-chlorinated, linear polyolefin polymer prepared from a reaction mixture comprising 0.5 to 5 percent by weight maleic anhydride based on the total weight of monomers in the reaction mixture; b) an aminoplast: and c) a polymer component comprising: i) an addition polymer prepared from a reaction mixture comprising coumarone; and/or ii) an alkyd resin. The present invention is also drawn to methods of improving fuel resistance of a coated article, comprising: (1) applying the solventborne film-forming composition above to a substrate to form a coated substrate; (2) applying a curable film-forming composition to at least a portion of the coated substrate formed in step (1) to form a multi-layer coated substrate; and (3) heating the multi-layer coated substrate formed in step (2) to a temperature and for a time sufficient to cure the film-forming composition.
Acrylic dispersants with fused aromatic imide anchor groups
Polymeric dispersants are disclosed that include an acrylic backbone at least one pendantly attached imide group, wherein the carbonyl of the imide are chemically bonded to a fused aromatic ring. The aromatic ring can be substituted with various electron withdrawing or releasing groups. Desirably dispersant also includes solvent-solubilising chains of polyether, polyester, polyacrylate, and or polyolefin.
Acrylic dispersants with fused aromatic imide anchor groups
Polymeric dispersants are disclosed that include an acrylic backbone at least one pendantly attached imide group, wherein the carbonyl of the imide are chemically bonded to a fused aromatic ring. The aromatic ring can be substituted with various electron withdrawing or releasing groups. Desirably dispersant also includes solvent-solubilising chains of polyether, polyester, polyacrylate, and or polyolefin.
Electrostatic image developing toner, electrostatic image developer, and toner cartridge
An electrostatic image developing toner includes toner base particles including at least a binder resin and a release agent, wherein the binder resin includes a hybrid resin having a polyester resin segment and a styrene-acrylic copolymer segment, and a molecular weight distribution curve of the toner satisfies Formula (1): 1.3b/a2.5, where, in the molecular weight distribution curve in which a perpendicular line is drawn from a baseline to a peak top having a peak top height to divide the molecular weight distribution curve into a lower-molecular-weight region and a higher-molecular-weight region, a represents a width of the lower-molecular-weight region at a height of 15% of the peak top height, and b represents a width of the higher-molecular-weight region at a height of 15% of the peak top height.