The invention provides a radically polymerizable resin composition capable of suppressing shrinkage while maintaining strength by adding an appropriate amount of an expansive additive to the radically polymerizable resin composition causing curing shrinkage by a decrease in the free volume of a liquid component during curing. The radically polymerizable resin composition comprises a radically polymerizable compound (A), an expansive additive (B), a radical polymerization initiator (C), and an aggregate (D). The aggregate (D) contains cement. The aggregate (D) is 330 to 800 parts by mass with respect to 100 parts by mass of the radically polymerizable compound (A).

[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution Means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.

[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution Means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.

The invention relates to an unsaturated polyester resin composition comprising: —a (meth)acrylate compound; and, —a polyester formed from at least: —reagent a) comprising itaconic acid and/or itaconic anhydride; —reagent b) comprising maleic acid, maleic anhydride, and/or fumaric acid; —reagent c) comprising dicyclopentadiene (DCPD); and, —reagent d) comprising at least one di- or poly-functional alcohol, preferably at least one diol; wherein the combined weight of reagent a) (i.e. the combined weight of itaconic acid and/or itaconic anhydride) is at least 10 wt. %, preferably at least 20 wt. %, of the total weight of di-acids and anhydrides used in the unsaturated polyester resin composition. The invention further relates to use of said unsaturated polyester resin for structural parts and for gel-coats. The invention also provides methods for preparing said unsaturated polyester resin composition.

The invention relates to an unsaturated polyester resin composition comprising: —a (meth)acrylate compound; and, —a polyester formed from at least: —reagent a) comprising itaconic acid and/or itaconic anhydride; —reagent b) comprising maleic acid, maleic anhydride, and/or fumaric acid; —reagent c) comprising dicyclopentadiene (DCPD); and, —reagent d) comprising at least one di- or poly-functional alcohol, preferably at least one diol; wherein the combined weight of reagent a) (i.e. the combined weight of itaconic acid and/or itaconic anhydride) is at least 10 wt. %, preferably at least 20 wt. %, of the total weight of di-acids and anhydrides used in the unsaturated polyester resin composition. The invention further relates to use of said unsaturated polyester resin for structural parts and for gel-coats. The invention also provides methods for preparing said unsaturated polyester resin composition.

The present invention provides a two-component (2K) curable composition comprising: (A) a first component comprising: i) at least one cyanoacrylate monomer represented by Formula 1:

H.sub.2C═C(CN)—COOR  (1) wherein: R is selected from C.sub.1-C.sub.18 alkyl, C.sub.3-C.sub.18 cycloalkyl, C.sub.2-C.sub.15 alkenyl, C.sub.6-C.sub.18 aryl, C.sub.7-C.sub.15 aralkyl and C.sub.3-C.sub.15 allyl; and, ii) peroxide catalyst; and, iii) at least one cure accelerator for said at least one cyanoacrylate monomer i); (B) a second component comprising: i) at least one free radically curable compound; and, ii) at least one transition metal compound, wherein, when said components are mixed together the peroxide catalyst initiates cure of said free radically curable compound(s) and the transition metal compound(s) initiates cure of the cyanoacrylate monomer(s), and further wherein said at least one free radically curable compound comprises at least one unsaturated polyester polymer containing at least two cycloolefinic double bonds.

The present invention provides a two-component (2K) curable composition comprising: (A) a first component comprising: i) at least one cyanoacrylate monomer represented by Formula 1:

H.sub.2C═C(CN)—COOR  (1) wherein: R is selected from C.sub.1-C.sub.18 alkyl, C.sub.3-C.sub.18 cycloalkyl, C.sub.2-C.sub.15 alkenyl, C.sub.6-C.sub.18 aryl, C.sub.7-C.sub.15 aralkyl and C.sub.3-C.sub.15 allyl; and, ii) peroxide catalyst; and, iii) at least one cure accelerator for said at least one cyanoacrylate monomer i); (B) a second component comprising: i) at least one free radically curable compound; and, ii) at least one transition metal compound, wherein, when said components are mixed together the peroxide catalyst initiates cure of said free radically curable compound(s) and the transition metal compound(s) initiates cure of the cyanoacrylate monomer(s), and further wherein said at least one free radically curable compound comprises at least one unsaturated polyester polymer containing at least two cycloolefinic double bonds.

An active energy ray-curable lithographic printing ink including a rosin-modified resin (A), an active energy ray-curable compound (B), a photopolymerization initiator (C), and an extender pigment (D), where the active energy ray-curable compound (B) includes dipentaerythritol hexaacrylate (B1), and an amount of the dipentaerythritol hexaacrylate (B1) relative to a total mass of the active energy ray-curable lithographic printing ink is within a range from 20 to 37% by mass. The photopolymerization initiator (C) includes at least two types of compounds selected from acylphosphine oxide-based compounds (C1), thioxanthone-based compounds (C2), and oxime ester-based compounds (C3), an amount of the extender pigment (D) relative to a total mass of the active energy ray-curable lithographic printing ink is within a range from 0.1 to 10% by mass, and a viscosity of the ink at 25° C. is within a range from 10 to 120 Pa.Math.s.

An active energy ray-curable lithographic printing ink including a rosin-modified resin (A), an active energy ray-curable compound (B), a photopolymerization initiator (C), and an extender pigment (D), where the active energy ray-curable compound (B) includes dipentaerythritol hexaacrylate (B1), and an amount of the dipentaerythritol hexaacrylate (B1) relative to a total mass of the active energy ray-curable lithographic printing ink is within a range from 20 to 37% by mass. The photopolymerization initiator (C) includes at least two types of compounds selected from acylphosphine oxide-based compounds (C1), thioxanthone-based compounds (C2), and oxime ester-based compounds (C3), an amount of the extender pigment (D) relative to a total mass of the active energy ray-curable lithographic printing ink is within a range from 0.1 to 10% by mass, and a viscosity of the ink at 25° C. is within a range from 10 to 120 Pa.Math.s.

Provided herein are systems and processes to control multiple temperatures in additive manufacturing. Such temperature control adjusts polymer properties and facilitates processing of materials to form 3D objects. The systems and processes disclosed herein also facilitate the processing of typically difficult-to-process materials and deliver such materials to a photocuring zone configured to photopolymerize materials into 3 dimensional objects with a layer-by-layer process. Such processes can include the steps of heating a resin to a flowable temperature, applying the resin to a carrier, cooling the film to increase viscosity or to solidify the resin, and applying the film containing the resin onto an area being printed, then photocuring the film. Also provided herein are resins and related polymer materials having properties that are tunable with exposure to more than one temperature zone. The formed polymers can include multiple regions of polymer material, each independently having distinct properties. Processes and systems are also provided herein that are configured to produce polymeric materials having multiple regions with distinct properties from a single-component formulation.