Patent classifications
C08F283/10
PREPARATION OF A STRUCTURAL TAPE-FROM-PASTE (TFP) ADHESIVE WITH BLUE LIGHT (VISIBLE) INITIATED B-STAGE CURE
According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.
POLYMERIZABLE COMPOSITION FOR THREE-DIMENSIONAL MODELING, PRODUCTION METHOD OF THREE-DIMENSIONAL MODEL USING SAME, AND THREE-DIMENSIONAL MODEL
The problem to be addressed by the invention is to provide a polymerizable composition for three-dimensional modeling used for producing three-dimensional models having high flexural modulus and impact strength, as well as high dimensional accuracy, and a production method for the composition. In order to solve the problem, the polymerizable composition for three-dimensional modeling contains an inorganic filler with an aspect ratio of 5 or greater, a dispersant, a photopolymerizable compound, and a thermally polymerizable compound.
POLYMERIZABLE COMPOSITION FOR THREE-DIMENSIONAL MODELING, PRODUCTION METHOD OF THREE-DIMENSIONAL MODEL USING SAME, AND THREE-DIMENSIONAL MODEL
The problem to be addressed by the invention is to provide a polymerizable composition for three-dimensional modeling used for producing three-dimensional models having high flexural modulus and impact strength, as well as high dimensional accuracy, and a production method for the composition. In order to solve the problem, the polymerizable composition for three-dimensional modeling contains an inorganic filler with an aspect ratio of 5 or greater, a dispersant, a photopolymerizable compound, and a thermally polymerizable compound.
Film touch sensor and method for fabricating the same
A film touch sensor includes a separation layer, a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer formed by curing an insulation layer forming composition comprising a polymer having a repeating unit represented by Formula 1 or 2, such that it is possible to suppress thermal damage which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
Film touch sensor and method for fabricating the same
A film touch sensor includes a separation layer, a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer formed by curing an insulation layer forming composition comprising a polymer having a repeating unit represented by Formula 1 or 2, such that it is possible to suppress thermal damage which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
Two-part epoxy based composition
This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.
Two-part epoxy based composition
This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING CONDUCTIVE COATING MATERIAL
A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING CONDUCTIVE COATING MATERIAL
A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).
Colored photosensitive resin composition and light shielding spacer prepared therefrom
The present invention relates to a colored photosensitive resin composition capable of forming a cured film that does not generate uneven wrinkles on its surface, to thereby minimize spots on the display screen that may be generated by a defect in the gap between the upper and lower plates during their assembly, with the formation of an excellent step difference and a pattern in a high resolution; and to a light shielding spacer produced therefrom and used for a liquid crystal display, an organic EL display, or the like.