Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

The invention relates to a fatty acid diamide-based rheology additive composition, which is pre-activated and pre-concentrated in fatty acid diamide, comprising: a) from 5% to 30% by weight of at least one fatty acid diamide based on 12 hydroxystearic acid and on a linear, in particular C5, C6 or C7, aliphatic diamine, b) from 70% to 95% by weight of at least one monofunctional (meth)acrylic reactive diluent comprising a cycloaliphatic group or several cycloaliphatic groups, the % being expressed relative to a)+b). It also relates to a process for preparing the composition and to the use thereof as a rheology additive in reactive binder compositions such as coating, moulding, composite material, anchor bolt or sealant compositions or photocrosslinkable compositions for stereolithography or for 3D printing of objects by inkjet.

The invention relates to a fatty acid diamide-based rheology additive composition, which is pre-activated and pre-concentrated in fatty acid diamide, comprising: a) from 5% to 30% by weight of at least one fatty acid diamide based on 12 hydroxystearic acid and on a linear, in particular C5, C6 or C7, aliphatic diamine, b) from 70% to 95% by weight of at least one monofunctional (meth)acrylic reactive diluent comprising a cycloaliphatic group or several cycloaliphatic groups, the % being expressed relative to a)+b). It also relates to a process for preparing the composition and to the use thereof as a rheology additive in reactive binder compositions such as coating, moulding, composite material, anchor bolt or sealant compositions or photocrosslinkable compositions for stereolithography or for 3D printing of objects by inkjet.

The present disclosure relates to a matting agent including emulsion polymer particles, a matting polymer composition including a matting agent, and a method of producing emulsion polymer particles. The emulsion polymer particles may be produced by a simple process using an emulsion polymerization method, and have the advantage of being relatively easy to control a degree of crosslinking. In addition, in a case where a matting polymer composition is prepared using a matting agent including the emulsion polymer particles, it is possible to manufacture a molded article having excellent appearance and matting effect without deterioration of the existing mechanical properties such as impact strength and tensile strength of a thermoplastic polymer, and in particular, an excellent matting effect may be exerted even in the extrusion processing, which has been difficult to achieve in the related art.

The present disclosure relates to a matting agent including polymer particles, a matting polymer composition including a matting agent, and a method of producing polymer particles. The polymer particles may be produced by a simple process using a suspension polymerization method, and is relatively easy to control a degree of crosslinking. In addition, in a case where a matting polymer composition is prepared using a matting agent including the polymer particles, it is possible to manufacture a molded article having excellent appearance and matting effect without deterioration of the existing mechanical properties such as impact strength and tensile strength of a thermoplastic polymer, and in particular, an excellent matting effect may be exerted even in the extrusion processing, which has been difficult to achieve in the related art.

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

The present invention is directed to a liquid one component (1 K) composition comprising, based on the weight of the composition: from 10 to 90 wt.% of a) at least one epoxy resin; from 0.5 to 30 wt.% of b) at least one organoboron compound selected from tetrasubstituted borate salts of monovalent cations of tertiary amines; from 10 to 50 wt.% of c) at least one (meth)acrylamide monomer of Formula (VII): [00001] wherein: R.sup.a is H or Me; G is selected from —NH.sub.2, —NHR.sup.b and —N(R.sup.b)(R.sup.c); R.sup.b and R.sup.care independently selected from C.sub.1-C.sub.18 alkyl, C.sub.1-C.sub.18 hydroxyalkyl, C.sub.1-C.sub.18 alkalkoxy, C.sub.6-C.sub.18 aryl and —(CH.sub.2).sub.n —N(R.sup.d)(R.sup.e); n is an integer of from 1 to 4; and, R.sup.d and R.sup.e are independently selected from H and C.sub.1-C.sub.6 alkyl; and, from 0.05 to 10 wt.% of d) at least one free radical photoinitiator.