Patent classifications
C08F283/10
DUAL CURE RESIN FOR THE PRODUCTION OF MOISTURE-RESISTANT ARTICLES BY ADDITIVE MANUFACTURING
Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.
DUAL CURE RESIN FOR THE PRODUCTION OF MOISTURE-RESISTANT ARTICLES BY ADDITIVE MANUFACTURING
Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.
Epoxy-acrylic hybrid adhesive
The invention relates to a two-component adhesive based on hybrid urethane-acrylate epoxies comprising a core/shell rubber demonstrating good T-peel strength. The adhesives are suitable for use in industry, e.g., as adhesives for transportation industry applications.
Epoxy-acrylic hybrid adhesive
The invention relates to a two-component adhesive based on hybrid urethane-acrylate epoxies comprising a core/shell rubber demonstrating good T-peel strength. The adhesives are suitable for use in industry, e.g., as adhesives for transportation industry applications.
Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
Casting of non-ferrous metals, especially aluminum and magnesium, can have problems with erosion, in which molten metal contacts the mold or core surfaces during the pouring process, resulting in the sand being dislodged. Binder systems addressing this issue often use bisphenol F epoxy resin. A binder system is provided in which a major portion of the epoxy resin component is a bisphenol epoxy resin that has been modified by incorporating oxazolidone rings into an epoxy backbone of the bisphenol epoxy resin, especially a bisphenol A epoxy resin. The modification is preferably achieved by reacting the diglycidyl ether of the bisphenol with a methylene diphenyl diisocyanate.
Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
Casting of non-ferrous metals, especially aluminum and magnesium, can have problems with erosion, in which molten metal contacts the mold or core surfaces during the pouring process, resulting in the sand being dislodged. Binder systems addressing this issue often use bisphenol F epoxy resin. A binder system is provided in which a major portion of the epoxy resin component is a bisphenol epoxy resin that has been modified by incorporating oxazolidone rings into an epoxy backbone of the bisphenol epoxy resin, especially a bisphenol A epoxy resin. The modification is preferably achieved by reacting the diglycidyl ether of the bisphenol with a methylene diphenyl diisocyanate.
Erosion resistant foundry shapes prepared with an epoxy-acrylate cold-box binder
Casting of non-ferrous metals, especially aluminum and magnesium, can have problems with erosion, in which molten metal contacts the mold or core surfaces during the pouring process, resulting in the sand being dislodged. Binder systems addressing this issue often use bisphenol F epoxy resin. A binder system is provided in which a major portion of the epoxy resin component is a bisphenol epoxy resin that has been modified by incorporating oxazolidone rings into an epoxy backbone of the bisphenol epoxy resin, especially a bisphenol A epoxy resin. The modification is preferably achieved by reacting the diglycidyl ether of the bisphenol with a methylene diphenyl diisocyanate.
PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY
Provided herein is a curable liquid stereolithography resin comprising (a) a divinylarene dioxide, such as for example a divinylbenene dioxide (DVBDO); (b) a free radically curable component, such as for example a (meth)acrylate component; (c) a cationic photoinitiator; and (d) a free radical photoinitiator. The stereolithography resin may comprise additional components, such as a cationically curable component other than a divinylarene dioxide. Preferably, the stereolithography resin has a viscosity at 25° C. of less than 400 mPa.Math.s.
PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY
Provided herein is a curable liquid stereolithography resin comprising (a) a divinylarene dioxide, such as for example a divinylbenene dioxide (DVBDO); (b) a free radically curable component, such as for example a (meth)acrylate component; (c) a cationic photoinitiator; and (d) a free radical photoinitiator. The stereolithography resin may comprise additional components, such as a cationically curable component other than a divinylarene dioxide. Preferably, the stereolithography resin has a viscosity at 25° C. of less than 400 mPa.Math.s.
PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY
Provided herein is a curable liquid stereolithography resin comprising (a) a divinylarene dioxide, such as for example a divinylbenene dioxide (DVBDO); (b) a free radically curable component, such as for example a (meth)acrylate component; (c) a cationic photoinitiator; and (d) a free radical photoinitiator. The stereolithography resin may comprise additional components, such as a cationically curable component other than a divinylarene dioxide. Preferably, the stereolithography resin has a viscosity at 25° C. of less than 400 mPa.Math.s.