A method of production of a semiconductor device comprising a semiconductor layer forming step of forming a semiconductor layer including an inorganic oxide semiconductor on a board, a passivation film forming step of forming a passivation film comprising an organic material so as to cover the semiconductor layer, a baking step of baking the passivation film, and a cooling step of cooling the passivation film after baking, herein, in the cooling step, a cooling speed from a baking temperature at the time of baking in the baking step to a temperature 50 C. lower than the baking temperature is substantially controlled to 0.5 to 5 C./min in range is provided.

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

The present invention relates to a method for producing a composite molded article having a flexural modulus at 150 C. of 25% or more of a flexural modulus at 23 C., including the steps of (1) placing glass fibers in a mold; (2) impregnating glass fibers with a polymerizable composition containing a cycloolefin monomer, a metathesis polymerization catalyst, a radical generator, and a compound represented by the general formula (I); (3) subjecting the above polymerizable composition with which the glass fibers are impregnated to a bulk polymerization to provide a composite molded article; and (4) demolding the composite molded article; and a composite molded article obtained by the above method. According to the method of the present invention, a composite molded article containing glass fibers, the composite molded article having excellent mechanical strength can be produced.