Disclosed are oral care compositions of novel phosphono-phosphate and anionic group containing polymer compositions that have targeted uses with divalent cations and surfaces having divalent cations. These compounds can be used to deliver anionic character to surfaces such as calcium hydroxyapatite for use in oral care applications.

An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R.sub.1, R.sub.2, R.sub.3, k, and X are as described herein.

##STR00001##

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

The present application is directed to a nanocomposite organo gel having a continuous polymeric network structure, wherein polymer chains are held together by ionic interaction between polymer chain ends, interparticle chain entanglements, layered silicate surface modifier, ionic salt, and layered silicate. The present application is also directed to methods of making and using the nanocomposite organo gel.

The present application is directed to a nanocomposite organo gel having a continuous polymeric network structure, wherein polymer chains are held together by ionic interaction between polymer chain ends, interparticle chain entanglements, layered silicate surface modifier, ionic salt, and layered silicate. The present application is also directed to methods of making and using the nanocomposite organo gel.

Provided are a curable composition including, a block copolymer including a block A which has a constitutional unit having an ethylenically unsaturated group in a side chain of a polymer compound, a pigment, and, a photopolymerization initiator, in which a content of a polymerizable compound is 15 mass % or less with respect to a total solid content of the curable composition; a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element or an image display device including the color filter.

A resin composition for forming a phase-separated structure includes a block copolymer having a block (b1) formed of a repeating structure of styrene units, the block (b1) being partially substituted with a constituent unit represented by the following General Formula (c1) and a block (b2) having a repeating structure of methyl methacrylate units. In the formula, R is a hydrogen atom or a methyl group and R.sup.c0 is a hydrophobic functional group ##STR00001##

Provided is a thermosetting resin composition capable of forming a resin layer having sufficiently low relative dielectric constant and dissipation factor, and high flexibility and toughness in a relatively short period of time, a cured material thereof, a prepreg, a laminate, a metal clad laminate, and a printed circuit board. This is accomplished by a thermosetting resin composition including a (A) polymerizable polyphenylene ether compound of General Formula (1), an (B) elastomer, and a (C) tetrafluoroethylene-based polymer particle, wherein a content of (C) is from 1 parts by mass to 30 parts by mass, with respect to 100 parts by mass of the composition.

To provide a novel resin having excellent dielectric properties, a method for producing the resin, a curable resin composition, and a cured product. The resin contains constituent units described in Group (1). R.sup.1 each independently represent a methylene group, a methylene oxy group, a methylene oxy methylene group, or an oxy methylene group. R.sup.2 and R.sup.3 each independently represent a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons. R.sup.4, R.sup.5, and R.sup.6 each independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy group, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons.

##STR00001##

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and at least one polyalkylene glycol ether selected from the group consisting of a polyalkylene glycol monoether and a polyalkylene glycol diether.