The invention relates to an ethylene polymer comprising a low molecular weight component and a high molecular weight component, wherein—the ethylene polymer has a density of 955 to 977 kg/m.sup.3 and a viscosity value η100 of at most 1500 Pa.Math.s and a strain hardening as determined according to ISO18488 of at least 25 MPa, for example 30 to 40 MPa,—the amount of the low molecular weight component with respect to the total ethylene polymer is at least 60 wt %,—the low molecular weight component has a Mw of 10,000 to 50,000 g/mol, a ratio of Mw/Mn of 2.5 to 4.5 and a density of 965 to 985 kg/m.sup.3 and—the high molecular weight component has a Mw of 100,000 to 1,000,000, a ratio of Mw/Mn of 2.5 to 4.0 and a density of 920 to 950 kg/m.sup.3.

Disclosed herein are ethylene-based polymers generally characterized by a density of at least 0.94 g/cm.sup.3, a high load melt index from 4 to 20 g/10 min, a zero-shear viscosity at 190° C. from 20,000 to 400,000 kPa-sec, and a relaxation time at 190° C. from 225 to 3000 sec. These ethylene polymers can be produced by peroxide-treating a broad molecular weight distribution Ziegler-catalyzed resin, and can be used in large diameter, thick wall pipes and other end-use applications.

Disclosed herein are ethylene-based polymers having low densities and narrow molecular weight distributions, but high melt strengths for blown film processing. Such polymers can be produced by peroxide-treating a metallocene-catalyzed resin.

Disclosed herein are ethylene-based polymers having low densities and narrow molecular weight distributions, but high melt strengths for blown film processing. Such polymers can be produced by peroxide-treating a metallocene-catalyzed resin.

The present invention is directed to a multimodal polyethylene copolymer comprising a first and a second copolymer of ethylene and at least two alpha-olefin comonomers. Such multimodal copolymers are highly suitable for conversion processes that require a high Draw Down Ratio, like the production of thin films. Such multimodal polyethylene copolymers provide a good impact strength in the sense of a high Dart drop impact strength (DDI) and good isotropy of the films produces thereof. The invention further presents final articles such as films made therefrom.

The present invention is directed to a multimodal polyethylene copolymer comprising a first and a second copolymer of ethylene and at least two alpha-olefin comonomers. Such multimodal copolymers are highly suitable for conversion processes that require a high Draw Down Ratio, like the production of thin films. Such multimodal polyethylene copolymers provide a good impact strength in the sense of a high Dart drop impact strength (DDI) and good isotropy of the films produces thereof. The invention further presents final articles such as films made therefrom.

The present invention relates to a novel ligand compound, a transition metal compound and a catalyst composition comprising the same. The novel ligand compound and the transition metal compound of the present invention may be useful as a catalyst of polymerization reaction for preparing an olefin-based polymer having a low density.

The present invention relates to a novel ligand compound, a transition metal compound and a catalyst composition comprising the same. The novel ligand compound and the transition metal compound of the present invention may be useful as a catalyst of polymerization reaction for preparing an olefin-based polymer having a low density.

The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C.sub.3/C.sub.2 copolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight M.sub.W of 1000 g/mol to 50,000 g/mol, and component B comprises one or more C.sub.2/C.sub.3 copolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight M.sub.W of 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.

The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C.sub.3/C.sub.2 copolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight M.sub.W of 1000 g/mol to 50,000 g/mol, and component B comprises one or more C.sub.2/C.sub.3 copolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight M.sub.W of 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.