The present invention provides a resist underlayer film composition for lithography, containing a compound having an indenofluorene structure. This resist underlayer film composition is excellent in filling property, generates little outgas, and has high heat resistance.

A polymer blend including: from 45 to 95 weight percent (wt %), preferably from 50 to 90 wt % of a polycarbonate having a weight average molecular weight greater than or equal to 25,000 g/mol and less than or equal to 80,000, preferably greater than or equal to 28,000 g/mol and less than or equal to 50,000, more preferably greater than or equal to 30,000 g/mol and less than or equal to 45,000; and from 5 to 55 wt %, preferably from 10 to 50 wt % of a polyaryletherketone; wherein the weight percentages are based on the total weight of the polymer blend; wherein an article molded from the polymer blend has a notched Izod impact strength greater than or equal to 400 J/m, preferably greater than or equal to 800 J/m, more preferably greater than or equal to 1000 J/m measured as per ASTM method D256-10 on a 3.2 millimeter (mm) thick sample.

A polymer blend including: from 45 to 95 weight percent (wt %), preferably from 50 to 90 wt % of a polycarbonate having a weight average molecular weight greater than or equal to 25,000 g/mol and less than or equal to 80,000, preferably greater than or equal to 28,000 g/mol and less than or equal to 50,000, more preferably greater than or equal to 30,000 g/mol and less than or equal to 45,000; and from 5 to 55 wt %, preferably from 10 to 50 wt % of a polyaryletherketone; wherein the weight percentages are based on the total weight of the polymer blend; wherein an article molded from the polymer blend has a notched Izod impact strength greater than or equal to 400 J/m, preferably greater than or equal to 800 J/m, more preferably greater than or equal to 1000 J/m measured as per ASTM method D256-10 on a 3.2 millimeter (mm) thick sample.

The present invention relates to an ion conductor, a method for producing the same, and an ion exchange membrane, a polymer electrolyte membrane and a fuel cell including the same. The ion conductor includes a repeat unit represented by the following Formula 1, and a repeat unit represented by the following Formula 2 or a repeat unit represented by the following Formula 5. Formulae 1, 2 and 3 are described as in the Detailed Description of the Invention.

The ion conductor contains a hydrocarbon-based block copolymer which has an easily changeable structure because it includes a hydrophilic region and a hydrophobic region, wherein characteristics of the block copolymer and the ion conductor can be easily regulated through control over the structure of the hydrophilic region and the hydrophobic region, and ion conductivity and durability of the ion conductor are improved within the whole humidity range through micro-phase separation between the hydrophilic region and the hydrophobic region which are structurally controlled.

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): ##STR00001##
wherein X is a structural site represented by the following Structural Formula (x1) or (x2); ##STR00002##
wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; ##STR00003##
wherein r is 1 or 2.

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): ##STR00001##
wherein X is a structural site represented by the following Structural Formula (x1) or (x2); ##STR00002##
wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; ##STR00003##
wherein r is 1 or 2.

A method for the preparation of a poly(ether ether ketone) (PEEK) includes: preparing the PEEK by aromatic nucleophilic substitution in the presence of: a) particulate sodium carbonate (Na.sub.2CO.sub.3), wherein said particulate sodium carbonate has a particle size distribution as follows: D.sub.9045 m and D.sub.90250 m and D.sub.99.5710 m, wherein said particle size distribution is measured by mechanical sieving in accordance with ASTM E 359-00 (reapproved 2005), wherein said measurement is based on the mechanical separation of various fractions on a series of superimposed sieves which are superimposed by descending order of opening mesh of 1000 m, 500 m, 250 m, 180 m, 125 m, 90 m, 63 m, and 45 m; and b) potassium carbonate (K.sub.2CO.sub.3) in an amount ranging from 0.001 to about 0.05 mol K/mol Na.

A method for the preparation of a poly(ether ether ketone) (PEEK) includes: preparing the PEEK by aromatic nucleophilic substitution in the presence of: a) particulate sodium carbonate (Na.sub.2CO.sub.3), wherein said particulate sodium carbonate has a particle size distribution as follows: D.sub.9045 m and D.sub.90250 m and D.sub.99.5710 m, wherein said particle size distribution is measured by mechanical sieving in accordance with ASTM E 359-00 (reapproved 2005), wherein said measurement is based on the mechanical separation of various fractions on a series of superimposed sieves which are superimposed by descending order of opening mesh of 1000 m, 500 m, 250 m, 180 m, 125 m, 90 m, 63 m, and 45 m; and b) potassium carbonate (K.sub.2CO.sub.3) in an amount ranging from 0.001 to about 0.05 mol K/mol Na.

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): ##STR00001##
wherein X is a structural site represented by the following Structural Formula (x1) or (x2); ##STR00002##
in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; ##STR00003##
wherein p is 1 or 2.

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): ##STR00001##
wherein X is a structural site represented by the following Structural Formula (x1) or (x2); ##STR00002##
in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; ##STR00003##
wherein p is 1 or 2.