A polycondensation product containing a phenolic copolymer useful for a hydraulic-composition dispersant that has stable dispersability and can obtain a prescribed fluidity, including a copolymer obtained by polycondensing a monomeric mixture including compounds A-D of formulas (A)-(D). A hydraulic-composition dispersant containing the product or copolymer. In the formulas, A1O, A2O, A3O, and A4O represent a C2-4 alkylene oxide group; m, n represent a number from 0 to 300 and m+n1; p, q represent a number from 1 to 300; X represents a hydrogen atom, alkyl group, or C1-24 acyl group; R0, R1 represent a hydrogen atom, alkyl group or alkenyl group; Y1, Y2 represent a hydrogen atom, phosphoester group, or sulfate ester group; Y3 represents a phosphoester or a sulfate ester group; R2 represents a hydrogen atom, carboxyl group, C1-10 alkyl group, C2-10 alkenyl group, phenyl group, napthyl group, or heterocyclic group; r represents a number from 1-100.

A polycondensation product containing a phenolic copolymer useful for a hydraulic-composition dispersant that has stable dispersability and can obtain a prescribed fluidity, including a copolymer obtained by polycondensing a monomeric mixture including compounds A-D of formulas (A)-(D). A hydraulic-composition dispersant containing the product or copolymer. In the formulas, A1O, A2O, A3O, and A4O represent a C2-4 alkylene oxide group; m, n represent a number from 0 to 300 and m+n1; p, q represent a number from 1 to 300; X represents a hydrogen atom, alkyl group, or C1-24 acyl group; R0, R1 represent a hydrogen atom, alkyl group or alkenyl group; Y1, Y2 represent a hydrogen atom, phosphoester group, or sulfate ester group; Y3 represents a phosphoester or a sulfate ester group; R2 represents a hydrogen atom, carboxyl group, C1-10 alkyl group, C2-10 alkenyl group, phenyl group, napthyl group, or heterocyclic group; r represents a number from 1-100.

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

The resist material according to the present invention contains a compound represented by the following formula (1): ##STR00001## wherein each R.sup.0 is independently a monovalent group having an oxygen atom, a monovalent group having a sulfur atom, a monovalent group having a nitrogen atom, a hydrocarbon group, or a halogen atom; and each p is independently an integer of 0 to 4.

The resist material according to the present invention contains a compound represented by the following formula (1): ##STR00001## wherein each R.sup.0 is independently a monovalent group having an oxygen atom, a monovalent group having a sulfur atom, a monovalent group having a nitrogen atom, a hydrocarbon group, or a halogen atom; and each p is independently an integer of 0 to 4.

There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b):

##STR00001##

[wherein two R.sup.1s are each independently a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R.sup.2s are each independently a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R.sup.3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R.sup.4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two C(CH.sub.3).sub.2 groups bonded to the benzene ring are in a meta position or a para position], and a solvent.

There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b):

##STR00001##

[wherein two R.sup.1s are each independently a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R.sup.2s are each independently a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R.sup.3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R.sup.4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two C(CH.sub.3).sub.2 groups bonded to the benzene ring are in a meta position or a para position], and a solvent.

Provided are a resin containing phenolic hydroxyl groups having excellent developability, heat resistance, and substrate followability, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl group. The resin containing phenolic hydroxyl groups obtained by reacting a novolac resin intermediate obtained by reacting a triarylmethane compound (A) with an aldehyde compound (B) as essential components, with an alkene compound (C) having 9 to 24 carbon atoms, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl groups.

Coating or resin compositions substantially free of bisphenol A with excellent surface adhesion comprising a compound in an effective amount of less than 10% w/w based on the resin with the following structure:

##STR00001##

The adhesion promoters are preferably aldehyde condensation products of aromatic carboxylic acid, phosphonic acid, phosphinic acid, sulphonic acid or sulphinic acid or its corresponding ionic form.

A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.