An underlayer composition, comprising a polymer comprising a repeating unit of formula (1):

wherein Ar is a monocyclic or polycyclic C.sub.5-60 aromatic group, wherein the aromatic group comprises one or more aromatic ring heteroatoms, a substituent group comprising a heteroatom, or a combination thereof; X is C or O; R.sup.1, R.sup.2; R.sup.a and R.sup.b are as provided herein; optionally, R.sup.1 and R.sup.2 can be taken together form a 5- to 7-membered ring; optionally, one of R.sup.11 to R.sup.13 can be taken together with R.sup.1 to form a 5- to 7-membered ring; wherein R.sup.a and R.sup.b optionally may be taken together to form a 5- to 7-membered ring; wherein one of R.sup.a or R.sup.b optionally may be taken together with R.sup.2 to form a 5- to 7-membered ring; and when X is O, R.sup.a and R.sup.b are absent.

##STR00001##

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

Processes for the manufacture of thermally curable resins contain the step of the reaction of a polycondensation-capable phenolic compound and/or of an aminoplastic forming agent with 5-hydroxymethylfurfural (HMF) under conditions leading to formation of polycondensation products. The HMF includes at least one HMF oligomer. Further, thermally curable resins produced by such processes may be used for the manufacture of a wood composite material.

A process for the manufacture of wood composite materials includes the steps of: preparation of a thermally curable resin by reacting a polycondensation-capable phenolic compound and/or an amino plastic forming agent with 5-hydroxymethylfurfural (HMF) under conditions leading to the formation of polycondensation products, bringing the resin into contact with lignocellulose-containing material, and curing the resin with formation of the wood composite material. The 5-hydroxymethylfurfural includes at least one HMF oligomer. Further, wood composite materials are obtainable by the process.

A method for producing thermosetting phenolic resins includes the step of reacting a polycondensable phenolic compound with 5-hydroxymethylfurfural (HMF) under conditions leading to the formation of polycondensation products. The HMF includes at least one HMF oligomer, and the reaction step is carried out at pH values greater than 7 for more than 60 minutes. Further, thermosetting phenolic resins may be used for producing a wood composite material.

A novolac-type phenolic hydroxyl group-containing resin with formula (1) as a structural site repeating unit, R.sup.1 represents one of a hydrogen atom, an alkyl group, and an aryl group, and X represents a structural site () represented by formula (2), R.sup.2 and R.sup.3 each represent one of a hydrogen atom, an alkyl group, an aryl group, and an aralkyl group; n and m are each an integer of 1 to 3; when n or m is 2 or 3, a plurality of each of R.sup.2 and R.sup.3 present in a molecule may be the same or different; and Ar represents one of a phenyl group, a naphthyl group, an anthryl group, and a structural site in which one or a plurality of hydrogen atoms in an aromatic nucleus of any one of these groups is substituted by one of an alkyl group, an aryl group, and an aralkyl group). ##STR00001##

The present invention provides a method for producing a composition for forming an organic film, the composition being used in a process of manufacturing a semiconductor apparatus, the method including the steps of (1) washing a compound having an aromatic skeleton by an acid, (2) preparing a composition solution containing the washed compound, (3) filtering the prepared composition solution through a filter, and (4) putting the filtered composition solution into a container made of an organic resin. There can be provided a method for producing a composition for forming an organic film that can form an organic film in which defects after dry etching are reduced.

The present invention provides a method for producing a composition for forming an organic film, the composition being used in a process of manufacturing a semiconductor apparatus, the method including the steps of (1) washing a compound having an aromatic skeleton by an acid, (2) preparing a composition solution containing the washed compound, (3) filtering the prepared composition solution through a filter, and (4) putting the filtered composition solution into a container made of an organic resin. There can be provided a method for producing a composition for forming an organic film that can form an organic film in which defects after dry etching are reduced.

The present invention provides a photosensitive composition having excellent heat resistance, low absorbance at the exposure light at wavelengths of g-line, h-line, and i-line, and satisfactory sensitivity even when the thickness of a resist film is increased, and also provides a resist material, a coating film thereof, a novolac phenol resin suitable for these applications, and a method for producing the phenol resin. Specifically, there is provided a novolac phenol resin produced by reacting a phenolic trinuclear compound (A) with formaldehyde under an acid catalyst, the phenolic trinuclear compound (A) including a phenolic trinuclear compound (A1) produced by condensation reaction of dialkyl-substituted phenol with a hydroxyl group-containing aromatic aldehyde and a phenol trinuclear compound (A2) produced by condensation reaction of dialkyl-substituted phenol having alkyl groups at the 2- and 3-positions, 2- and 5-position, the 3- and 4-positions, or 3- and 5-positions with an aromatic aldehyde not having a hydroxyl group, wherein the molar ratio of the phenolic trinuclear compound (A1) to the phenolic trinuclear compound (A2) is 20:80 to 90:10.