A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.

The present invention provides a photosensitive composition having excellent heat resistance, low absorbance at the exposure light at wavelengths of g-line, h-line, and i-line, and satisfactory sensitivity even when the thickness of a resist film is increased, and also provides a resist material, a coating film thereof, a novolac phenol resin suitable for these applications, and a method for producing the phenol resin. Specifically, there is provided a novolac phenol resin produced by reacting a phenolic trinuclear compound (A) with formaldehyde under an acid catalyst, the phenolic trinuclear compound (A) including a phenolic trinuclear compound (A1) produced by condensation reaction of dialkyl-substituted phenol with a hydroxyl group-containing aromatic aldehyde and a phenol trinuclear compound (A2) produced by condensation reaction of dialkyl-substituted phenol having alkyl groups at the 2- and 3-positions, 2- and 5-position, the 3- and 4-positions, or 3- and 5-positions with an aromatic aldehyde not having a hydroxyl group, wherein the molar ratio of the phenolic trinuclear compound (A1) to the phenolic trinuclear compound (A2) is 20:80 to 90:10.

A process for the manufacture of a reinforced product comprising a matrix based on a composition and at least one reinforcing element, the reinforcing elements being embedded in the matrix, comprises: mixing of the composition based on: a compound A1 with a melting point T1, and a compound A2 with a melting point T2, at a temperature Tm such that: T1≤Tm<T2, so as to dissolve A2 in A1 and to obtain the composition in the liquid state; submerging of the reinforcing element(s) (36) in the composition; and crosslinking by heating of the composition at a temperature Tn such that: T1≤Tm<Tn.

The present disclosure relates to organic compound(s) (i.e., compound of formula I or compound of formula IA) and/or a composition including the organic compound(s) useful for utilization of non-coking coal in a blend including coking coal without deterioration of properties of coking coal, wherein the organic compound(s) is capable of releasing hydrogen in the plastic region of coal. The present disclosure provides a simple, economical, non-toxic and efficient method for the preparation of the organic polymer, and a method for utilization of non-coking coal in blend including coking coal without deterioration of the properties of coke.

The present disclosure relates to organic compound(s) (i.e., compound of formula I or compound of formula IA) and/or a composition including the organic compound(s) useful for utilization of non-coking coal in a blend including coking coal without deterioration of properties of coking coal, wherein the organic compound(s) is capable of releasing hydrogen in the plastic region of coal. The present disclosure provides a simple, economical, non-toxic and efficient method for the preparation of the organic polymer, and a method for utilization of non-coking coal in blend including coking coal without deterioration of the properties of coke.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

The present invention has an object to provide a new compound that is useful as a film forming material for lithography or an optical component forming material, a resin containing a constituent unit derived from said compound, a composition, a resist pattern formation method, a circuit pattern formation method, and a purification method.

A compound represented by formula (1), a resin containing a constituent unit derived from said compound, a composition containing one or more selected from the group consisting of said compound and said resin, a resist pattern formation method using said composition, a circuit pattern formation method, and a purification method thereof.

A composition for forming a resist underlayer film containing a solvent and polymer comprising a unit structure (A) represented by formula (1) and/or formula (2). The composition is capable of forming a hydrophobic underlayer film that has a high contact angle with pure water and exhibits high adhesion to an upper layer film, thereby being not susceptible to separation therefrom, while meeting the requirement of good coatability, the composition being also capable of exhibiting other good characteristics such as sufficient resistance to a chemical agent that is used for resist underlayer films.