The resin solid acid is a sulfo group-modified resin obtained by introducing sulfo groups into a raw material resin in an uncarbonized state, the yield of the sulfo group-modified resin based on the weight of the uncarbonized raw material resin is 80% or more, the amount of sulfo groups in the sulfo group-modified resin is 1 mmol/g or more, and the raw material resin is in the form of a powder, granules or fibers. In addition, the method for producing the resin solid acid is a production method for obtaining a sulfo group-modified resin by comprising a step for adding a sulfonating agent in the form of any of sulfuric acid, fuming sulfuric acid or chlorosulfonic acid to a raw material resin in an uncarbonized state, and a step for heating the uncarbonized raw material resin at 200 C. or lower.

In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.

In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.

Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. The polyphenolic compound can include a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof.

A phenolic epoxy resin and a method for manufacturing the same are provided. The method for manufacturing the phenolic epoxy resin includes: injecting cardanol and vanillin into a reactor; heating the reactor, and adding an acidic catalyst into the reactor at a temperature ranging from 60 C. to 90 C., such that a phenolic resin is formed from the cardanol and the vanillin through polycondensation; mixing the phenolic resin and epichlorohydrin for a substitution reaction to form a phenolic epoxy resin at a temperature ranging from 55 C. to 70 C. The vanillin is a limited agent. An acidity coefficient pKa value of the acidic catalyst at 25 C. in water is lower than 3.1.

A phenolic epoxy resin and a method for manufacturing the same are provided. The method for manufacturing the phenolic epoxy resin includes: injecting cardanol and vanillin into a reactor; heating the reactor, and adding an acidic catalyst into the reactor at a temperature ranging from 60 C. to 90 C., such that a phenolic resin is formed from the cardanol and the vanillin through polycondensation; mixing the phenolic resin and epichlorohydrin for a substitution reaction to form a phenolic epoxy resin at a temperature ranging from 55 C. to 70 C. The vanillin is a limited agent. An acidity coefficient pKa value of the acidic catalyst at 25 C. in water is lower than 3.1.

A novolak resin including a partial structure represented by C(CF.sub.3)H. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by C(CF.sub.3)H. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by C(CF.sub.3)H. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by C(CF.sub.3)H with epihalohydrin in a presence of a base.

A resin composition for a stator, which is used for forming a sealing member in a stator including a stator core having a plurality of teeth parts and a plurality of slots that are alternately formed in a circumferential direction, a coil wound around the slot, accommodated in the slot, and having a pair of coil ends that each protrude over both sides from the stator core in an axial direction, and a sealing member provided by covering the coil in the slot, the resin composition for a stator including a thermosetting component, in which a cured product obtained by thermally curing the resin composition for a stator has a structure represented by Formula (1) and has an easily disassembling property. (In Formula (1), R1 and R2 each independently represent any of a hydrogen atom, a hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxyl group having 1 to 30 carbon atoms.)