Patent classifications
C08G8/28
Process for the high-yield preparation of P-(R)calix[9-20]arenes
A process for the high-yield preparation of p-(R)calix[9-20]arenes.
Process for the high-yield preparation of P-(R)calix[9-20]arenes
A process for the high-yield preparation of p-(R)calix[9-20]arenes.
Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating
Provided is a modified hydroxy naphthalene novolak resin which is optimal for a photosensitive composition and a resist material having high optical sensitivity, resolution, and alkali developability, and excellent heat resistance and moisture absorption resistance, and the modified hydroxy naphthalene novolak resin includes a structural moiety (I) represented by Structural Formula as a repeating unit: ##STR00001## wherein R.sup.1is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group; m is 1 or 2; R.sup.2's each independently is any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and at least one of the R.sup.1's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.
Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating
Provided is a modified hydroxy naphthalene novolak resin which is optimal for a photosensitive composition and a resist material having high optical sensitivity, resolution, and alkali developability, and excellent heat resistance and moisture absorption resistance, and the modified hydroxy naphthalene novolak resin includes a structural moiety (I) represented by Structural Formula as a repeating unit: ##STR00001## wherein R.sup.1is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group; m is 1 or 2; R.sup.2's each independently is any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and at least one of the R.sup.1's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.
Modified phenolic resins and methods of making and using the same as reinforcing resins
This invention relates to processes for preparing novolak resins and using the same as reinforcing resins. One process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted; and reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted. Another process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, and reacting the resole resin with one or more phenolic compounds under an elevated temperature to form a novolac resin.
Modified phenolic resins and methods of making and using the same as reinforcing resins
This invention relates to processes for preparing novolak resins and using the same as reinforcing resins. One process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, wherein for each mole of alkylphenol at least 1.5 moles of aldehyde are reacted; and reacting the resole resin with one or more phenolic compounds in the presence of an acidic catalyst to form a novolac resin, wherein for each mole of alkylphenol at least 1.5 moles of the phenolic compounds are reacted. Another process comprises reacting one or more alkylphenols with an aldehyde in the presence of a base to form a resole resin, and reacting the resole resin with one or more phenolic compounds under an elevated temperature to form a novolac resin.
IN-SITU ALKYLPHENOL-ALDEHYDE RESINS
The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.
IN-SITU ALKYLPHENOL-ALDEHYDE RESINS
The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.
PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.
##STR00001##
Phosphonated polymers, and methods of production thereof, for use as polymer electrolyte membranes (PEMs) and/or catalyst ionomeric binders for electrodes in PEM fuel cells
The present disclosure provides phosphonated polymers that can be used, for example, as polymer electrolyte membranes (PEMs) and/or catalyst ionomeric binders for electrodes in PEM fuel cells, and more particularly for high-temperature PEM fuel cells. High-temperature PEM fuel cells that use phosphonated polymers of the present disclosure suffer from reduced or no acid leaching because, in at least some examples, phosphonic acid moieties are covalently bound to the backbone of the polymers. A phosphonated polymer include a backbone having one or more aromatic monomers, with each aromatic monomer having one or more phosphonic acid groups. A phosphonic acid group may include phosphonic acid or a functional group that is hydrolysable into phosphonic acid.