The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%.

##STR00001##

(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

A stepped substrate coating composition for forming a coating film having planarity on a substrate, including: a main agent and a solvent, the main agent containing a compound (A), a compound (B), or a mixture thereof, the compound (A) having a partial structure Formula (A-1) or (A-2):

##STR00001##

and the compound (B) having at least one partial structure selected from Formulae (B-1)-(B-5), or having a partial structure including a combination of a partial structure of Formula (B-6) and a partial structure of Formula (B-7) or (B-8):

##STR00002##

where the composition is cured by photoirradiation or by heating at 30 C.-300 C.; and the amount of the main agent in the solid content of the composition is 95%-100% by mass.

The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent:

##STR00001## wherein R.sup.1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R.sup.2 to R.sup.5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R.sup.2 to R.sup.5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m.sup.2 and m.sup.3 are each independently an integer of 0 to 8; m.sup.4 and m.sup.3 are each independently an integer of 0 to 9, provided that m.sup.2, m.sup.3, m.sup.4, and m.sup.3 are not 0 at the same time; n is an integer of 1 to 4; and p.sup.2 to p.sup.5 are each independently an integer of 0 to 2.

This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.

This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.

The present disclosure provides phosphonated polymers that can be used, for example, as polymer electrolyte membranes (PEMs) and/or catalyst ionomeric binders for electrodes in PEM fuel cells, and more particularly for high-temperature PEM fuel cells. High-temperature PEM fuel cells that use phosphonated polymers of the present disclosure suffer from reduced or no acid leaching because, in at least some examples, phosphonic acid moieties are covalently bound to the backbone of the polymers. A phosphonated polymer include a backbone having one or more aromatic monomers, with each aromatic monomer having one or more phosphonic acid groups. A phosphonic acid group may include phosphonic acid or a functional group that is hydrolysable into phosphonic acid.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

Disclosed are methods for producing a downstream product from cellulosic material by: a) contacting the cellulosic material with a polymer and a solvent to form a reaction mixture, where the polymer includes acidic monomers and ionic monomers connected to form a polymeric backbone, and each of the ionic monomers independently comprises at least one nitrogen-containing cationic group or at least one phosphorous-containing cationic group; b) degrading the cellulosic material in the reaction mixture to produce a liquid phase and a solid phase, where the liquid phrase includes one or more sugars, and where the solid phase includes residual cellulosic material; and c) using the one or more sugars to produce the downstream product.