A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.

Disclosed is a resist composition including a novolak resin in which a hydroxy group is substituted with a group represented by formula (3), an acid generator, a quencher, and a solvent:

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wherein, in formula (3), R.sup.a10 represents a hydrocarbon group having 1 to 20 carbon atoms (e.g., a chain hydrocarbon group such as an alkyl group, an alkenyl group and an alkynyl group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, groups formed by combining these groups, etc.) and * represents a bond.

A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).

A new novolac curing agent with an alkoxysilyl group exhibiting excellent heat resistance such as a low CTE and an high Tg when a composite is formed, a preparing method of the same, a composition including the same, a cured article, and an use thereof, are provided. The new novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a preparing method of the new novolac curing agent by alkenylation and alkoxysilylation of the novolac curing agent, a preparing method of the new novolac curing agent by alkoxysilylation of a novolac curing agent, a composition including a novolac curing agent having an alkoxysilyl group of Formulae I-1 to I-4, a cured article and a use thereof, are provided. A composite including a novel novolac curing agent having an alkoxysilyl group exhibits a low CTE and a high glass transition temperature.

The invention relates to cyanate ester resin blends containing resveratrol-based cyanate esters. At room temperature, the cyanate ester resin blend offers improved processability by remaining a liquid or forming a solid that melts at less than 70? C. The cyanate ester resin blend includes a resveratrol-based cyanate ester and a flexible cyanate ester having a configuration different than that of the resveratrol-based cyanate ester, where the resveratrol-based cyanate ester is no more than 80% of the total mass of the cyanate esters in the cyanate ester resin blend. A composite product can include the cyanate ester resin blend and a support material. When making the composite product, the support material is combined with the cyanate resin blend and cured at temperatures ranging from about 100? C. to about 300? C.

The invention relates to cyanate ester resin blends containing resveratrol-based cyanate esters. At room temperature, the cyanate ester resin blend offers improved processability by remaining a liquid or forming a solid that melts at less than 70? C. The cyanate ester resin blend includes a resveratrol-based cyanate ester and a flexible cyanate ester having a configuration different than that of the resveratrol-based cyanate ester, where the resveratrol-based cyanate ester is no more than 80% of the total mass of the cyanate esters in the cyanate ester resin blend. A composite product can include the cyanate ester resin blend and a support material. When making the composite product, the support material is combined with the cyanate resin blend and cured at temperatures ranging from about 100? C. to about 300? C.

The present invention relates to a composition of additives comprising: at least one first compound selected from: (i) copolymers of ethylene and vinyl acetate having a molar mass Mn included in the range ranging from 10,000 to 60,000 g.Math.mol1, optionally grafted by at least one alkyl (meth)acrylate group, the alkyl chain of which is saturated and contains from 12 to 30 carbon atoms; and (ii) polymers comprising at least 90 mol % of units derived from alkyl. (meth)acrylate monomer, the alkyl chain of which is saturated and contains from 18 to 22 carbon atoms; and at least one second compound selected from the modified alkylphenol-aldehyde resins. The invention also relates to the use of this composition of additives for lowering the viscosity of a liquid petroleum product such as a crude oil and for reducing the deposition of paraffins.

The present invention relates to a composition of additives comprising: at least one first compound selected from: (i) copolymers of ethylene and vinyl acetate having a molar mass Mn included in the range ranging from 10,000 to 60,000 g.Math.mol1, optionally grafted by at least one alkyl (meth)acrylate group, the alkyl chain of which is saturated and contains from 12 to 30 carbon atoms; and (ii) polymers comprising at least 90 mol % of units derived from alkyl. (meth)acrylate monomer, the alkyl chain of which is saturated and contains from 18 to 22 carbon atoms; and at least one second compound selected from the modified alkylphenol-aldehyde resins. The invention also relates to the use of this composition of additives for lowering the viscosity of a liquid petroleum product such as a crude oil and for reducing the deposition of paraffins.

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi.sub.4O.sub.9; (B) a filler different from the BaTi.sub.4O.sub.9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi.sub.4O.sub.9 (A) is 0.10 to 1.00 m, and a volume ratio of the BaTi.sub.4O.sub.9 (A) to the filler (B), the BaTi.sub.4O.sub.9(A):the filler (B), ranges from 15:85 to 80:20.

This invention relates to a phenolic resin composition comprising a phenolic resin admixed with and/or modified by one or more functionalized organosulfur compounds. This invention also relates to a rubber composition comprising (i) a natural rubber, a synthetic rubber, or a mixture thereof; (ii) one or more phenolic resins; and (iii) one or more functionalized organosulfur compounds. The interaction between the component (i) and the components (ii) and (iii) reduces the hysteresis increase compared to a rubber composition without the component (iii), upon curing the rubber composition. The invention also relates to a process for preparing the phenolic resin composition, a process for preparing the rubber composition, and a process for reducing the hysteresis increase caused in a rubber composition when a phenolic resin is added to a rubber composition.