Provided are [1] a furan resin comprising a repeating unit represented by the following general formula (1); and [2] a method for producing a furan resin, comprising reacting a specific furan compound and a specific carbonyl compound in the presence of an acid catalyst:

##STR00001## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, or an organic group having 1 to 8 carbon atoms which may contain a hetero atom; and R.sup.1 and R.sup.2, and R.sup.3 and R.sup.4 may be connected to each other to form a cyclic structure.

A production method of an addition condensation product includes a step at which an aromatic compound, a carbonyl compound, and a catalyst are mixed in a reaction solvent, and an addition condensation reaction of the aromatic compound and the carbonyl compound is conducted in the temperature range of 60 to 97° C., both inclusive, to obtain the addition condensation product of the aromatic compound and the carbonyl compound. At the step to obtain the addition condensation product, 1 mole of the aromatic compound is mixed with 0.1 to 0.999 mole, both inclusive, of the carbonyl compound as the mole ratio. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Provided is an addition condensation product of an aromatic compound and a carbonyl compound. The addition condensation product includes an aromatic compound dimer in which two composition units derived from the aromatic compounds are bonded via one composition unit derived from the carbonyl compound and an aromatic compound multimer in which each of three or more composition units derived from the aromatic compounds is bonded via one composition unit derived from the carbonyl compound. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

A method for making a multi-part resin system includes forming a lignin-formaldehyde resin, forming a phenol-formaldehyde resin, and mixing the lignin-formaldehyde resin and the phenol-formaldehyde to form the multi-part resin system.

Provided is a method of producing activated carbon from a resin composite made up of furanic polymer. The method includes producing a resin composite from feedstock (e.g., in the presence of an acid and a salt), combining the resin composite with a base to form an impregnated material, and carbonizing the impregnated material to produce the and salt activated carbon. Provided herein are also resin composites and activated carbon materials.

A resist underlayer film for lithography does not cause intermixing with a resist layer, has high dry etching resistance and high heat resistance, and generates a low amount of sublimate. A resist underlayer film-forming composition containing a polymer having a unit structure of the following formula (1): ##STR00001##
wherein A is a divalent group having at least two amino groups, the group is derived from a compound having a condensed ring structure and an aromatic group for substituting a hydrogen atom on the condensed ring, and B.sup.1 and B.sup.2 are each independently a hydrogen atom, an alkyl group, a benzene ring group, a condensed ring group, or a combination thereof, or B.sup.1 and B.sup.2 optionally form a ring with a carbon atom bonded to B.sup.1 and B.sup.2.

The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent. ##STR00001##

A resist underlayer film for lithography does not cause intermixing with a resist layer, has high dry etching resistance and high heat resistance, and generates a low amount of sublimate. A resist underlayer film-forming composition containing a polymer having a unit structure of the following formula (1):

##STR00001##

wherein A is a divalent group having at least two amino groups, the group is derived from a compound having a condensed ring structure and an aromatic group for substituting a hydrogen atom on the condensed ring, and B.sup.1 and B.sup.2 are each independently a hydrogen atom, an alkyl group, a benzene ring group, a condensed ring group, or a combination thereof, or B.sup.1 and B.sup.2 optionally form a ring with a carbon atom bonded to B.sup.1 and B.sup.2.

Resins are provided including bisphenol M diphthalonitrile ether resin or bisphenol P diphthalonitrile either resin. Compositions are also provided, including a primary amine curative and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. Further, polymerized products are provided of the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin. In addition, a method of making a polymerized network is provided. A two component system is further provided, including a curative in one of the components and the bisphenol M diphthalonitrile ether resin or the bisphenol P diphthalonitrile either resin in the other component. In addition, a resin blend is provided, including a blend of at least two of bisphenol M diphthalonitrile ether resin, bisphenol P diphthalonitrile either resin, or bisphenol T diphthalonitrile ether resin.

Crosslinked polymers made up of polymerized units of phenothiazine, pyrrole, and aldehyde. The crosslinked polymers are porous with a BET surface area in the range of 300-600 m.sup.2/g. A method of synthesizing the crosslinked polymers is described. Processes for using the crosslinked polymers as adsorbent materials for adsorbing gases (e.g. CO.sub.2 capturing), and separating fluid mixtures under dry and wet conditions are also introduced.