Methods of preparing poly(cyanocinnamate)s are provided, with those involving mild conditions and resulting in a soluble polymer that is stable at room temperature and can be coated onto microelectronic substrates. The polymer includes at least one bis(cyanoacetate) monomer and at least one aromatic dialdehyde monomer. The polymer exhibits good thermal and structural properties and high absorbance in the UV range.

The invention relates to a method for the preparation of a polymerized CNSL composition, the method comprising subjecting a raw or technical CNSL to a heat treatment under reflux to obtain the polymerized CNSL composition, wherein the heat treatment is performed until the polymerized CNSL composition has a molecular weight M.sub.w of about 2800 to about 3700, such as from about 2900 to about 3600, or from about 3000 to about 3500 g/mol. The invention further relates to a polymerized CNSL composition, use of a polymerized CNSL composition according to the invention in a bitumen composition, a modified bitumen composition according to the invention and an asphalt composition comprising a modified bitumen composition according to the present invention.

The invention relates to a method for the preparation of a polymerized CNSL composition, the method comprising subjecting a raw or technical CNSL to a heat treatment under reflux to obtain the polymerized CNSL composition, wherein the heat treatment is performed until the polymerized CNSL composition has a molecular weight M.sub.w of about 2800 to about 3700, such as from about 2900 to about 3600, or from about 3000 to about 3500 g/mol. The invention further relates to a polymerized CNSL composition, use of a polymerized CNSL composition according to the invention in a bitumen composition, a modified bitumen composition according to the invention and an asphalt composition comprising a modified bitumen composition according to the present invention.

A resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol M diphthalonitrile ether resin. Another resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol T diphthalonitrile ether resin. The resin blends prior to cure have more favorable processing and curing properties compared to the resorcinol diphthalonitrile resin alone, enabling greater ease in manufacturing.

An aromatic polyphenol derivative comprising at least one aromatic ring bearing at least two OZ groups in the meta position relative to one another, the two positions ortho to at least one of the OZ groups being unsubstituted, is used for the manufacture of a phenol-aldehyde resin for reinforcing a rubber composition. Each OZ group represents an OSi(R.sub.1R.sub.2R.sub.3) group with R.sub.1, R.sub.2, R.sub.3 representing, independently of one another, a hydrocarbon-based radical or a substituted hydrocarbon-based radical.

The present invention provides a resist multilayer film-attached substrate, including a substrate and a resist multilayer film formed on the substrate, in which the resist multilayer film has an organic resist underlayer film difficultly soluble in ammonia hydrogen peroxide water, an organic film soluble in ammonia hydrogen peroxide water, a silicon-containing resist middle layer film, and a resist upper layer film laminated on the substrate in the stated order. There can be provided a resist multilayer film-attached substrate that enables a silicon residue modified by dry etching to be easily removed in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.

A resist underlayer film-forming composition that exhibits a high etching resistance, a favorable dry etching rate ratio and optical constant, and can form a film exhibiting a good coatability even to a so-called uneven substrate, providing a small difference in film thickness after embedding, and having planarity and a superior hardness; a resist underlayer film formed from the resist underlayer film-forming composition; and a method of producing a semiconductor device. The composition including a reaction product between a compound of the following Formula (1) or (2) and a compound of the following Formula (3), and a solvent:

##STR00001##

The present invention provides a compound selected from the group consisting of compounds represented by the following formula (1):

##STR00001## wherein each R.sup.S is independently a hydrogen atom, an alkyl group, which has 1 to 30 carbon atoms, and which optionally has a substituent, an aryl group, which has 6 to 30 carbon atoms, and which optionally has a substituent, an alkenyl group, which has 2 to 30 carbon atoms, and which optionally has a substituent, an alkoxy group, which has 1 to 30 carbon atoms, and which optionally has a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group or a hydroxy group, wherein the alkyl group, the aryl group, the alkenyl group, and the alkoxy group each optionally contain an ether bond, a ketone bond, or an ester bond; wherein at least one R.sup.S is a hydroxy group; and each R.sup.T is independently a hydrogen atom, an alkyl group, which has 1 to 30 carbon atoms, and which optionally has a substituent, an aryl group, which has 6 to 30 carbon atoms, and which optionally has a substituent, an alkenyl group, which has 2 to 30 carbon atoms, and which optionally has a substituent, an alkoxy group, which has 1 to 30 carbon atoms, and which optionally has a substituent, a halogen atom, a nitro group, an amino group, a carboxylic acid group, a thiol group or a hydroxy group, wherein the alkyl group, the aryl group, the alkenyl group, and the alkoxy group each optionally contain an ether bond, a ketone bond, or an ester bond, wherein two R.sup.T are optionally bonded to include a cyclic structure.

The present invention provides an optical member forming composition comprising a compound represented by the following formula (0):

##STR00001##

A tribologically modified polyoxymethylene polymer composition is disclosed. The polyoxymethylene polymer composition is comprised of a polyoxymethylene polymer and at least one tribological modifier. The tribological modifier may comprise at least one tribological modifier comprising an ultra-high molecular weight silicone having a kinematic viscosity of greater than 100,000 mm.sup.2 s.sup.1. The composition may exhibit a dynamic coefficient of friction against a counter-material of from about 0.01 to about 0.15. The polyoxymethylene polymer compositions provide polymer articles with improved tribological properties and mechanical properties.