Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.

The formaldehyde-free binder for materials containing cellulose contains a hydroxy aldehyde resin polycondensed with an ammonium salt, the resin being obtained, in especially preferred embodiments, from glycerin, in situ, with the aid of hydrogen peroxide. A protein component consisting of animal blood is added. The binder is urea-free and can be used as a one-component or two-component binder. It binds materials such as wood, paper and other natural fibres to form high-quality composite material products.

The present invention provides a novel cyanic acid ester compound that has excellent solvent solubility and provides a cured product having a low rate of thermal expansion and having excellent flame retardance and heat resistance, and a resin composition containing the compound, etc. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board excellent in peel strength, glass transition temperature, rate of thermal expansion, rate of water absorption, and thermal conductivity. The present invention provides a resin composition whose cured product obtained by curing can achieve a printed circuit board not only having a high glass transition temperature and low thermal expansibility but being also excellent in flexural modulus and thermal conductivity. The cyanic acid ester compound is represented by the general formula (1):

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Disclosed are a highly adaptable viscosity-reducing polycarboxylate water reducer and its preparation method and application. The highly adaptable viscosity-reducing polycarboxylate water reducer is composed of a polymer and water, and the polymer accounts for 30-50 wt %; since the main chain of the polymer contains a hydrophobic benzene ring and hydrophilic amine, the polymer has strong rigidity and good solubility in an aqueous solution, and is rich in two adsorption groups of carboxyl group/phosphono group. The highly adaptable viscosity-reducing polycarboxylate water reducer of the present invention has excellent water-reducing and slump retention properties and is suitable for general construction projects and commercial concrete projects. Compared with the conventional polycarboxylate water reducer, the highly adaptable viscosity-reducing polycarboxylate water reducer of the present invention has strong adaptability to concrete materials and can effectively reduce the viscosity of high-strength concrete (C50-C100), thus having bright application prospects in the high-end water reducer market.

Disclosed are a highly adaptable viscosity-reducing polycarboxylate water reducer and its preparation method and application. The highly adaptable viscosity-reducing polycarboxylate water reducer is composed of a polymer and water, and the polymer accounts for 30-50 wt %; since the main chain of the polymer contains a hydrophobic benzene ring and hydrophilic amine, the polymer has strong rigidity and good solubility in an aqueous solution, and is rich in two adsorption groups of carboxyl group/phosphono group. The highly adaptable viscosity-reducing polycarboxylate water reducer of the present invention has excellent water-reducing and slump retention properties and is suitable for general construction projects and commercial concrete projects. Compared with the conventional polycarboxylate water reducer, the highly adaptable viscosity-reducing polycarboxylate water reducer of the present invention has strong adaptability to concrete materials and can effectively reduce the viscosity of high-strength concrete (C50-C100), thus having bright application prospects in the high-end water reducer market.

Provided are [1] a furan resin comprising a repeating unit represented by the following general formula (1); and [2] a method for producing a furan resin, comprising reacting a specific furan compound and a specific carbonyl compound in the presence of an acid catalyst: ##STR00001## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, or an organic group having 1 to 8 carbon atoms which may contain a hetero atom; and R.sup.1 and R.sup.2, and R.sup.3 and R.sup.4 may be connected to each other to form a cyclic structure.

A resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol M diphthalonitrile ether resin. Another resin blend is provided including a blend of resorcinol diphthalonitrile ether resin and a bisphenol T diphthalonitrile ether resin. The resin blends prior to cure have more favorable processing and curing properties compared to the resorcinol diphthalonitrile resin alone, enabling greater ease in manufacturing.

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.

A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.

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The present invention provides a resist multilayer film-attached substrate, including a substrate and a resist multilayer film formed on the substrate, in which the resist multilayer film has an organic resist underlayer film difficultly soluble in ammonia hydrogen peroxide water, an organic film soluble in ammonia hydrogen peroxide water, a silicon-containing resist middle layer film, and a resist upper layer film laminated on the substrate in the stated order. There can be provided a resist multilayer film-attached substrate that enables a silicon residue modified by dry etching to be easily removed in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.

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