Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:

##STR00001##

in which in Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and

##STR00002##

in which in Formula (2), R.sup.1 to R.sup.18 are each the same as in Formula (1).

Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:

##STR00001##

in which in Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and

##STR00002##

in which in Formula (2), R.sup.1 to R.sup.18 are each the same as in Formula (1).

A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

Provided is a curable epoxy composition capable of forming a cured product having excellent heat resistance even in a high temperature environment. A first curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), and an imidazole-based curing accelerator (C), and is liquid at 25° C. and to be used for a rotary electric machine. A second curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), an imidazole-based curing accelerator (C), and a polyester polyol (D), and is to be used for a rotary electric machine.

Provided is a curable epoxy composition capable of forming a cured product having excellent heat resistance even in a high temperature environment. A first curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), and an imidazole-based curing accelerator (C), and is liquid at 25° C. and to be used for a rotary electric machine. A second curable epoxy composition includes an alicyclic epoxy compound (A) having an alicyclic structure and an epoxy group in a molecule, an acid anhydride-based curing agent (B), an imidazole-based curing accelerator (C), and a polyester polyol (D), and is to be used for a rotary electric machine.

A method includes using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens or salts of trifluoromethanesulfonic acid as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring means. Another method includes the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws and the like in boreholes in various substrates.

Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.

##STR00001##

In the formula, R.sup.1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R.sup.2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.