The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity (weight-average molecular weight to number-average molecular weight ratio) of 1.0 to 3.0.
[R.sup.1SiO.sub.3/2]  (1)
[Chem. 2]
[R.sup.aSiO.sub.3/2]  (I)
[Chem. 3]
[R.sup.bSiO(OR.sup.c)]  (II)
[Chem. 4]
[R.sup.1SiO(OR.sup.c)]  (4)

A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained. The two-composition polyether sealant system has good compatibility, greatly improves the adhesive properties thereof, achieves a good adhesion and waterproofing effect without needing to be used with a priming coating, and also avoids the risk of water leakage caused by misoperation in the applying of the priming coating existing in the prior art.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30 and at least one polymer obtained from the polymerization of one or more ethylenically unsaturated monomers and their use for forming coatings or binder agents, especially for decorative and protective coating applications on various substrates.

An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30 and at least one polymer obtained from the polymerization of one or more ethylenically unsaturated monomers and their use for forming coatings or binder agents, especially for decorative and protective coating applications on various substrates.

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.