The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R.sup.aSiO.sub.3/2] (I) and constituent units represented by formula (II) [R.sup.aSiO.sub.2/2(OR.sup.b)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

The present invention relates to fluorine compounds (I), (II) and (III), to processes for the preparation thereof, and to the use thereof.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units. The polyorganosilsesquioxane has a number-average molecular weight of 1,000 to 3,000 and a molecular-weight dispersity (weight-average molecular weight to number-average molecular weight ratio) of 1.0 to 3.0.
[R.sup.1SiO.sub.3/2]  (1)
[Chem. 2]
[R.sup.aSiO.sub.3/2]  (I)
[Chem. 3]
[R.sup.bSiO(OR.sup.c)]  (II)
[Chem. 4]
[R.sup.1SiO(OR.sup.c)]  (4).

A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

The invention describes a low temperature process for high performance epoxy resins purification via membrane separation technology. Continuous or semi-continuous low temperature processing grants a minimized material aging during product purification as for example glycidyl amine based resins.