A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw material with an epoxy resin in the presence of water, so as to obtain an ionic active emulsifier. The ionic active emulsifier molecule comprises at least one epoxy group from an epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material. The aqueous epoxy resin dispersion prepared by using the emulsifier has the characteristics of good stability and good corrosion resistance after curing, and can be used in the fields of coatings, adhesives, etc.

A composition formed of an epoxy resin incorporating a fire retardant.

The invention relates to dioxomolybdenum (VI) complex compounds of the formula MoO.sub.2(L).sub.x(Y).sub.2-x, where the ligand L has the formula (I). Such complex compounds are suitable in particular as catalysts for one- and two-component polyurethane compositions. The invention also relates to two-component polyurethane compositions including at least one polyisocyanate as the first component, at least one polyol as the second component, and at least one such dioxomolybdenum (VI) complex compound as the catalyst. The invention further relates to one-component polyurethane compositions comprising at least one polyurethane prepolymer with isocyanate groups, which are made from at least one polyisocyanate with at least one polyol, and comprising such a dioxomolybdenum (VI) complex compound as the catalyst. The invention additionally relates to different uses of said polyurethane compositions. ##STR00001##

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

Provided is an epoxy-amine adduct that offers high reactivity, contributes to better adhesion between a resin and a reinforcing fiber in a fiber-reinforced composite material, and can be easily blended with another component such as a resin. The epoxy-amine adduct has two or more amino groups per molecule and is obtained by a reaction of an epoxy compound (A) having two or more alicyclic epoxy groups per molecule with an amine compound (B) having two or more amino groups per molecule. The epoxy compound (A) is preferably a compound represented by Formula (a): ##STR00001##

Grafted triglycerides comprising a triglyceride grafted with a fatty acid residue containing 4 to 30 carbon atoms are reacted with an epoxide resin and an amine curing agent to yield an epoxy thermoset. The grafted triglyceride is prepared by reaction of an epoxidized triglyceride with a fatty acid. By varying the length of the fatty residue, the number of fatty residues per triglyceride, the identity of the epoxy resin and the amine curing agent, it is possible to prepare epoxy thermosets that exhibit superior physical properties compared to the properties of epoxy thermosets prepared without the grafted triglyceride, or as compared to epoxy thermosets wherein the epoxidized triglyceride is used in place of the grafted triglyceride.

An epoxy resin oligomer is provided. The epoxy resin oligomer is obtained by the reaction of at least a first reactant and a second reactant, and the molecular weight of the epoxy resin oligomer is between 3000 and 9000, wherein the mole ratio of the first reactant and the second reactant is between 1:0.9 and 0.9:1, and each of the first reactant and the second reactant is a compound having two polymerizable groups.

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. ##STR00001##
wherein m is a number of 1 to 10; R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are each hydrogen, alkyl, or aryl; R.sup.5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.