To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

The present invention relates to a cross-linkable composition comprising an epoxy oligomer comprising at least six hydroxy groups, to a coating obtained by curing the cross-linkable composition and to an optical lens comprising said coating on a surface thereof, in particular on the edge surface thereof. The invention also relates to a method of preparing a coating for an optical lens and to a method of coating a surface of an optical lens, in particular the edge surface of an optical lens.

The present invention relates to resist compositions comprising a polymer component, a photoacid generator component (PAG), a photoactive diazonaphthoquinone component (PAC), a base component, a solvent component, and optionally, a heterocyclic thiol component. The polymer component is a Novolak derivative, comprising Novolak repeat units with free phenolic hydroxy moieties, and Novolak repeat units comprising phenolic hydroxy moieties protected with an acid cleavable acetal moiety. The acetal moiety is elected from a mono functional alkyl acetal moiety protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, an acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety; a di-functional acetal comprising moiety, linking and protecting two repeat units comprising Novolak phenolic hydroxy moieties, forming a linking point in said polymer component between two different polymer chains in said polymer component, and a mixture of any of these three types of acid cleavable acetal moieties. The PAC component is selected from said acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, a free PAC component, and a mixture of these two types of PAC components. The present invention also relates to the methods of using the present compositions in either in thick or thin film photoresist device manufacturing methodologies.

Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

An electromagnetic steel sheet coated with an insulating film with excellent hardness and suitable for use as a material for iron cores of large-sized electric-power generators; and a process for producing the electromagnetic steel sheet coated with an insulating film. The purpose is achieved with a coating material for forming insulating films, the coating material including a solvent and components (A) to (C) contained therein in the respective amounts on a solid basis. (A) A water-compatible carboxylated resin; 100 parts by mass. (B) An aluminum-containing oxide; more than 40 parts by mass but less than 300 parts by mass per 100 parts by mass of the component (A). (C) At least one crosslinking agent selected from the group containing of melamine, isocyanates, and oxazoline; 100 parts by mass or more but less than 300 parts by mass per 100 parts by mass of the component (A).

Phosphorus-containing flame retardant mixtures, a process for production of said mixtures and use of said mixtures, and also epoxy resin formulations which comprise said flame retardant mixtures. The present invention relates to phosphorus-containing flame retardant mixtures, comprising individual flame retardants having in each case one or more functional groups of the formulae (I), (II) and (III), where, based on the total quantity of functional groups in the flame retardant mixture, 1 to 98 mol % of functional groups of the formula (I), 1 to 35 mol % of functional groups of the formula (II) and 1 to 98 mol % of functional groups of the formula (III) are present, and where R.sup.1 and R.sup.2 are identical or different and are mutually independently hydrogen, C.sub.1- to C.sub.12-alkyl, linear or branched, and/or C.sub.6- to C.sub.18-aryl and the entirety of (I), (II) and (III) is always 100 mol %.

##STR00001##

A curable composition comprising: i) a glycidyl ether of a novolac, comprising or consisting of moieties having the formula (I), wherein —R.sub.a is either always hydrogen or always methyl; —B is either always *—CH2-** or always formula (A); —a fraction of 0.8 to 0.99 of the Y moieties are essentially —O-glycidyl, this fraction being designated as x, and the remainder of the Y moieties, this fraction being designated as (1-x), are divalent bridging spacers of the structure *—O—CH.sub.2—CH(OH)—CH.sub.2—O—** connecting two moieties according to above formula (I); and—n is a number in the range of 0.1 to 3.0; and wherein said novolac glycidyl ether has an epoxy equivalent weight FEW in the range of 160 to 270 g/eq. and the average number of epoxy groups per molecule of novolac glycidyl ether (I), designated as f, is in the range of 2.1 to 5.0; ii) dicyandiamide; and iii) an urea derivative of the formula (II). This composition is stable upon storage at room temperature and fire-retardant. It can be used for preparation of prepregs and in core filling, particularly in the aerospace field.