The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

This invention provides methods for coating food and beverage containers using polymers which are preferably polyether polymers. The invention further provides liquid and powder coating compositions including such polymers and which have utility in a variety of other coating end uses, including, for example, valve and pipe coatings.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

A method for improving corrosion resistance of vinyl ester resin is provided, which belongs to the technical field of polymer materials. The method includes adding vinyl ester resin into a MXene nanosheet solution and evaporating the solvent; then adding cobalt isooctoate promoter and butanone peroxide initiator in sequence, standing for curing after defoaming, and then heating.

An inkjet method for producing a spectacle lens and fluids that can be used in an inkjet method for producing a spectacle lens are disclosed. The inkjet method includes the following steps: a) providing a substrate to be printed on, b) applying to the substrate to be printed on from step a) at least two volume elements applied adjacently and/or adjoining one another, c) transferring the at least two volume elements applied adjacently and/or adjoining one another from step b) into at least one volume composite, d) transferring the at least one volume composite from step c) into at least one homogeneous volume composite, e) transferring the at least one homogeneous volume composite from step d) into at least one final volume composite.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

A composition for forming a resist underlayer film and a method for producing a resist pattern, the method using the composition for forming a resist underlayer film; and a method for producing a semiconductor device. A resist underlayer film-forming composition which contains an organic solvent and a polymer that has an end blocked with a compound (A), wherein: the polymer is derived from compound (B) that is represented by formula (11). (In formula (11), Y1 represents a single bond, an oxygen atom, a sulfur atom, an alkylene group having from 1 to 10 carbon atoms, the alkylene group being optionally substituted by a halogen atom or an aryl group having from 6 to 40 carbon atoms, or a sulfonyl group; each of T1 and T2 represents an alkyl group having from 1 to 10 carbon atoms; and each of n1 and n2 independently represents an integer from 0 to 4.)

A composition for forming a resist underlayer film and a method for producing a resist pattern, the method using the composition for forming a resist underlayer film; and a method for producing a semiconductor device. A resist underlayer film-forming composition which contains an organic solvent and a polymer that has an end blocked with a compound (A), wherein: the polymer is derived from compound (B) that is represented by formula (11). (In formula (11), Y1 represents a single bond, an oxygen atom, a sulfur atom, an alkylene group having from 1 to 10 carbon atoms, the alkylene group being optionally substituted by a halogen atom or an aryl group having from 6 to 40 carbon atoms, or a sulfonyl group; each of T1 and T2 represents an alkyl group having from 1 to 10 carbon atoms; and each of n1 and n2 independently represents an integer from 0 to 4.)

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.