Curable epoxy resin compositions are provided that are mixtures containing an epoxy resin and composite particles. The composite particles have a porous polymeric core, a nitrogen-based curing agent for an epoxy resin positioned within the porous polymeric core, and a coating layer around the porous polymeric core. The nitrogen-containing curing agent typically does not react with the epoxy resin until the curable composition is heated causing the release of the nitrogen-containing curing agent from the composite particle. Additionally, cured epoxy resins formed from the curable composition and method of forming cured epoxy resins are provided.

An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.

The invention relates to a process for cationic electrodeposition coating using cationic water-dilutable binders comprising a water-soluble bismuth salt or chelate complex B, and a chain-extended epoxy-amine adduct EA which comprises moieties derived from epoxide compounds E2 having at least two epoxide groups per molecule, low molar mass epoxide compounds E3 having two epoxide groups per molecule, one or more of amidoamines A41 having at least one amide group and at least one amino group, made from amines A1 having at least two amino groups per molecule and a fatty acid A4, further amines A1, an amine A2 which has at least one secondary amino group per molecule, an amine A3 having at least one tertiary, and at least one primary amino group per molecule, fatty acids A4, and phenolic compounds A5 having at least two phenolic hydroxyl groups.

An electrochemical oxygen sensor includes a sensing surface having a working electrode and a reference electrode, a hydrophilic layer formed from an oxygen diffusion-limiting layer emulsion overlaying the working electrode and a hydrophobic membrane formed from a hydrophobic solution disposed over the hydrophilic layer. The hydrophilic layer contains an epoxy network and a hydrophilic polymer. The hydrophobic layer contains an acetate copolymer and a cross-linking agent that reacts with the liquid epoxy resin in the hydrophilic layer forming the epoxy network where the hydrophobic member is water vapor and oxygen permeable.

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.

The present invention relates to a composition comprising an aqueous solution of an acid suppressible hydrophobically modified alkylene oxide polymer and a phosphoric acid ester surfactant. The composition of the present invention provides a pourable thickener with high solids content and good phase stability.