The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and has a solids content of 90% or greater. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; an optional second hydroxyl-containing compound having a single OH group; an epoxy component; and an accelerator. The first hydroxyl-containing compound has more than one OH group and the optional second hydroxyl-containing compound is a primary alcohol or a secondary alcohol. The present disclosure also provides a two-part composition, in which a polymeric material is included in the first part and the second part includes at least one thiol-containing compound. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymeric material and a method of making a two-part composition. Advantageously, two-part compositions according to the present disclosure can be used as coatings and adhesive systems with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferably at least one first dye; a second part (B) comprising at least one second dye different from the at least one first dye and at least one epoxy resin; (b) Mixing part (A) and part (B) of the two-component adhesive composition precursor so as to obtain an adhesive composition; (c) Applying the adhesive composition onto a first part; (d) Applying a second part onto the adhesive composition applied to the first part; and then performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change; or (e) Performing a first curing step at a first temperature, wherein the adhesive composition undergoes a first colour change, and then applying a second part onto the adhesive composition applied to the first part; (f) Perform a second curing step at a second temperature higher than the first temperature, thereby fully curing the adhesive composition so as to obtain a structural adhesive bond between the first and second parts, wherein the adhesive composition undergoes a second colour change.

A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η′2/η′1 equal to 3 or less, wherein η′1 is an initial dynamic shear viscosity (Pa.Math.s) and η′2 is a maximum value of dynamic shear viscosity (Pa.Math.s), in a measurement of dynamic shear viscosity.

An aliphatic epoxy resin precursor composition containing an epoxy component and, optionally, a reactive component, the composition containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component. A cured aliphatic epoxy resin containing a precursor composition and a curing component, the precursor composition including an epoxy component and, optionally, a reactive component, and the cured resin containing no phenols, wherein the epoxy component is a glycerol-based ether, and wherein the precursor composition contains greater than about 60% (w/w) of the epoxy component and between 0% and 30% (w/w) of the reactive component.

Particles of encapsulated first epoxy resin (microcapsules) comprise: a) a core of first epoxy resin, within b) a shell comprising an organic polymer, and c) a layer of oil-in-water Pickering emulsifier particles borne on an outer surface of the shell. These particles may be used in liquid adhesive compositions, solid adhesive compositions such as tapes, or in other applications. In various embodiments, the oil-in-water Pickering emulsifier particles comprise materials selected from the group consisting of silica, fumed silica, calcium carbonate, barium sulfate, clay, carbon black, iron oxide, carbon nanotubes, latex, block copolymer micelles, polystyrene, poly(methyl methacrylate), any of the preceding materials which additionally are surface-modified, and combinations thereof. Particles of encapsulated epoxy resin may have an average diameter of 0.1-1000 micrometers, or in some embodiments 30-300 micrometers. The oil-in-water Pickering emulsifier particles may have an average diameter of 5-1000 nanometers, 5-100 nanometers, or in some embodiments 5-50 nanometers.

A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a functionalized polyetherimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride, a substituted or unsubstituted C.sub.1-40 organic diamine, and optionally an organic compound, wherein the functionalized polyetherimide includes a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyetherimide has a total reactive end group concentration of 50-1,500 μeq/g and 0.05-1,000 ppm by weight of residual organic diamine, wherein the functionalized polyetherimide is obtained by precipitation from a solution using an organic anti-solvent, or by devolatilization, and the organic compound comprises at least two functional groups/molecule.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.