A composition for forming a resist underlayer film that enables formation of an intended resist pattern, and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses said composition for forming a resist underlayer film. A composition for forming an EUV resist underlayer film includes: a compound represented by formula (1); a polymer; and an organic solvent. (In formula (1), Y1 represents a single bond, an oxygen atom, a sulfur atom, a halogen atom, or a C1-10 alkylene group which may be substituted with a C6-40 aryl group, or a sulfonyl group, T1 and T2 each represent a C1-10 alkyl group, R1 and R2 each independently represent a C1-10 alkyl group which is substituted with at least one hydroxy group, and n1 and n2 each independently represent an integer of 0-4).

A process for preparing a curing agent for epoxy resins, in which an amine mixture including at least one parent amine of the formula (I) and at least one alkylated amine of the formula (II) is reacted or adducted with at least one glycidyl ether of the formula (III). The amine mixture is especially a reaction mixture from the partial alkylation of the amine of the formula (I). The process described enables, with low energy expenditure and high space-time yield, curing agents of low odor, low toxicity, low viscosity and high reactivity for epoxy resins and epoxy resin products that cure rapidly at ambient temperatures and especially also under cold conditions and at the same time enable high-quality coatings having an even, shiny surface.

Provided is a water-based epoxy resin composition and a cured product thereof, the water-based epoxy resin composition obtained by blending a water-based epoxy resin (A) and a curing agent composition (B) containing a reaction product (b1) of epichlorohydrin and an amine compound represented by the following formula (1), the water-based epoxy resin composition having a content ratio of the component (A) and the component (B) defined as [number of epoxy groups in component (A)/number of active amine hydrogens in component (B)] of 1/1.1 to 1/0.3:

H.sub.2N—CH.sub.2—A—CH.sub.2—NH.sub.2   (1)

wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.

The invention describes an advanced mixing and metering technology with online analytics for a supply of formulated liquid thermosetting resins into an open or closed mold. The application addresses where a precise control of the composition of formulated components is required. Composite structures used in primary and secondary structural aerospace applications manufactured in Infusion or RTM processes are possible examples.

The invention describes an advanced mixing and metering technology with online analytics for a supply of formulated liquid thermosetting resins into an open or closed mold. The application addresses where a precise control of the composition of formulated components is required. Composite structures used in primary and secondary structural aerospace applications manufactured in Infusion or RTM processes are possible examples.

A coil has a winding that is coated with an epoxy resin in at least some areas, wherein a ratio of a compressive strength of the epoxy resin to the tensile strength thereof at room temperature ranges between 2 and 5, the modulus of elasticity at room temperature is at least 5000 MPa, and at a glass transition temperature of the epoxy resin, the modulus of elasticity and the tensile strength have values amounting to at least 30% of the values at room temperature.

The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40° C.

An object of the present invention is to provide an epoxy resin, an epoxy resin-containing composition, and a cured product which are excellent in flexibility. The present invention relates to an epoxy resin, which is a reaction product of an epoxy compound (A) and an acid-terminated polyester (B). In addition, the present invention relates to an epoxy resin-containing composition and a cured product obtained by using the epoxy resin.

An amine-functional adduct from the reaction of at least one amine of the formula (I) with at least one novolak epoxy resin having an average functionality in the range from 2.5 to 4. The adduct is liquid at room temperature without thinners and without a large excess of amine. It is suitable as a curing agent for epoxy resin compositions, in which it permits good workability, rapid curing, high hydrophobicity, and a high crosslinking density. It is particularly suitable for coatings, in which it permits nice surfaces, good intercoat adhesion, high thermal shock resistance, and good protection against steel corrosion.