Patent classifications
C08G67/02
Polymer composition, electronic device and method of manufacturing the same
The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
Polymer composition, electronic device and method of manufacturing the same
The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
Polyketone polymerization catalyst
Provided are a novel polyketone polymerization catalyst and a method of preparing a ligand, which can reduce production costs and can enable commercial mass synthesis by using ((2,2-dimethyl-1,3-dioxane-5,5-diyl)bis(methylene))bis(bis(2-methoxyphenyl)phosphine) as a ligand constituting the polykeytone polymerization catalyst, the ligand having a simple structure and a small molecular weight while having high activity.
Polyketone polymerization catalyst
Provided are a novel polyketone polymerization catalyst and a method of preparing a ligand, which can reduce production costs and can enable commercial mass synthesis by using ((2,2-dimethyl-1,3-dioxane-5,5-diyl)bis(methylene))bis(bis(2-methoxyphenyl)phosphine) as a ligand constituting the polykeytone polymerization catalyst, the ligand having a simple structure and a small molecular weight while having high activity.
UNIT FOR MANAGING TECHNICAL INFORMATION OF A SITE
A unit for managing initial saving, subsequent saving, and reading technical information such as plans, figures, executed works, manuals, notebooks, a visitors' book, maintenance records, and the like of a site such as a building, a ship, a platform, an industrial facility, and the like, the unit comprising a casing incorporating an electronic circuit comprising a non-volatile memory, a USB connector and a processor controlled by firmware controlling the management of inputs and outputs and of the memory, wherein the firmware comprises means for managing the inputs-outputs according to the standard USB protocol, and in addition for preventing the change command from modifying information previously recorded in the non-volatile memory.
UNIT FOR MANAGING TECHNICAL INFORMATION OF A SITE
A unit for managing initial saving, subsequent saving, and reading technical information such as plans, figures, executed works, manuals, notebooks, a visitors' book, maintenance records, and the like of a site such as a building, a ship, a platform, an industrial facility, and the like, the unit comprising a casing incorporating an electronic circuit comprising a non-volatile memory, a USB connector and a processor controlled by firmware controlling the management of inputs and outputs and of the memory, wherein the firmware comprises means for managing the inputs-outputs according to the standard USB protocol, and in addition for preventing the change command from modifying information previously recorded in the non-volatile memory.
Compositions Comprising Ethylene-Carbon Monoxide Copolymers
The invention provides a composition comprising an ethylene-based polymer and wherein the ethylene-based polymer has the following properties: (A) a CO content from greater than 0 to less than 10 weight percent CO (carbon monoxide), based on the weight of the polymer, and (B) a melt index (I2) from 0.1 to less than 3 g/10 min; and (C) a density from 0.923 to 0.928 g/cc; and wherein the ethylene-based polymer has a melting point, Tm, in C., that meets the following relationship: Tm ( C.)<601.4*(Density N in g/cc)447.8 C.
POLYKETONE POWDER FOR LASER SINTERING
In one instance a semicrystalline polyketone powder useful for additive manufacturing is comprised of a bimodal melt peak determined by an initial differential scanning calorimetry (DSC) scan at 20? C./min and a D.sub.90 particle size of at most 300 micrometers and average particle size of 1 micrometer to 150 micrometers equivalent spherical diameter. In another instance, A composition is comprised of a semicrystalline polyketone powder having a melt peak and a recrystallization peak, wherein the melt peak and recrystallization peak fail to overlap.
POLYKETONE POWDER FOR LASER SINTERING
In one instance a semicrystalline polyketone powder useful for additive manufacturing is comprised of a bimodal melt peak determined by an initial differential scanning calorimetry (DSC) scan at 20? C./min and a D.sub.90 particle size of at most 300 micrometers and average particle size of 1 micrometer to 150 micrometers equivalent spherical diameter. In another instance, A composition is comprised of a semicrystalline polyketone powder having a melt peak and a recrystallization peak, wherein the melt peak and recrystallization peak fail to overlap.
Polyketone compound
An aliphatic polyketone compound including 85.0 to 99.5 wt % aliphatic polyketone and 0.5 to 15.0 wt % ultra-high molecular weight polyethylene. An aliphatic polyketone compound described where the ultra-high molecular weight polyethylene is 2.0 to 8.0 wt %. An aliphatic polyketone compound where the ultra-high molecular weight polyethylene has a molecular weight greater than 1.0 million g/mol.