A structurally supported non-pneumatic tyre comprises a tread, an annular band, a plurality of spokes extending transversely and radially inside the annular band, and means for connecting the plurality of spokes to a wheel, characterized in that the spokes comprise a polymeric composition based on at least one polymeric matrix comprising 50 to 70% of one or more thermoplastic polymers, the glass transition temperature (Tg) of which is within a range extending from 120 to 250° C. and 30 to 50% of one or more thermoplastic elastomers, said thermoplastic elastomer(s) being compatible with said thermoplastic polymer(s), such that the elongation at break of the mixture of these polymers is greater than or equal to the elongation at break of the thermoplastic polymer(s) alone.

The present invention relates to a moulding compound which contains at least 50 wt. % of a semicrystalline poly amide component and the moulding compound contains a filler which imparts conductivity to the moulding compound, wherein the moulding compound does not have a crystallite melting point (Tm) below 50° C. and the polyamide component contains components A and B, A) PA homopolymer of the type PA X.Y or PAZ, where X is a diamine radical (DA), Y is a dicarboxyl radical (DC), and Z is an alpha-omega amino acid radical; B) PA copolymer of the type PA X′.Y′, where X is a diamine radical (DA′) and Y′ is a dicarboxyl radical (DC′); wherein a portion of the diamine radical (DA′) is replaced by a polyether having at least two amino termini or at least two hydroxy termini; wherein the proportion of polyether in the sum of components A and Bis between 0.5 and 15 wt. % and wherein the proportion of filler is 2.5 to 6 wt. % based on the total mass of the poly amide component and the filler. The invention also relates to a method for producing same and using same, and to hollow profiles comprising same.

The present invention relates to a composition comprising (i) an unsaturated dicarboxylic acid, an ester or an anhydride thereof and (ii) aliphatic diol, (iii) dianhydrohexitol, (iv) cycloaliphatic diol and/or aromatic aliphatic diol, and (v) an amide-forming agent. Further, the invention relates to an unsaturated polyesteretheramide obtainable by condensation of the composition of the invention and to an unsaturated polyesteretheramide resin comprising the unsaturated polyesteretheramide and a reactive diluent. The invention further relates to a thermoset with high thermo-mechanical properties.

The present invention relates to a compound obtained by a process comprising the following steps: (i) Reacting at least one isocyanate containing compound, in stoichiometric excess, with a first isocyanate-reactive compound having a number average molecular weight lower than 400, resulting in the formation of at least one prepolymer, (ii) Reacting said prepolymer, in stoichiometric excess, with a second isocyanate-reactive compound having a number average molecular weight equal to or higher than 400, resulting in the formation of a modified prepolymer, (iii) Reacting said modified prepolymer with a hydroxyl-ester compound or a hydroxyl-acid compound with the formation of hydroxyl-ester terminated prepolymer or hydroxyl-acid terminated prepolymer, and Ring-closing said hydroxyl-ester terminated prepolymer or hydroxyl-acid terminated prepolymer; (iv) Formation of said compound made of oxazolidinedione-terminated prepolymer and oxazolidinedione-terminated monomer, which is soluble in said oxazolidinedione-terminated prepolymer.

An object of the present invention is to provide an antistatic agent which imparts excellent antistatic properties to thermoplastic resins. The antistatic agent (Z) of the present invention contains a block polymer (A) having a block of a polyamide (a) and a block of a polyether (b1) as structure units, wherein the polyether (b1) contains propylene oxide (PO) and ethylene oxide (EO) as constituent monomers, and a weight ratio of the propylene oxide (PO) to the ethylene oxide (EO), i.e., propylene oxide (PO)/ethylene oxide (EO), is 1/99 to 25/75.

The present invention relates to a moulding composition comprising by weight: (A) 65% to 98%, in particular 65% to 95%, of at least one copolyamide with amide units (Ba1) and polyether units (Ba2), (B) 2% to 30%, in particular 5% to 30%, of hollow glass reinforcement, (C) 0 to 5%, preferably 0.1% to 2%, of at least one additive, the sum of the proportions of each constituent (A) + (B) + (C) of the composition being equal to 100%.

The present invention relates to a moulding composition comprising by weight: (A) 65% to 98%, in particular 65% to 95%, of at least one copolyamide with amide units (Ba1) and polyether units (Ba2), (B) 2% to 30%, in particular 5% to 30%, of hollow glass reinforcement, (C) 0 to 5%, preferably 0.1% to 2%, of at least one additive, the sum of the proportions of each constituent (A) + (B) + (C) of the composition being equal to 100%.

A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

Oligomeric substances which contain one or more (meth)acryloyl functional groups as well as two or more amide functional groups are useful as components of compositions which may be cured using actinic irradiation to provide polymeric articles.