A part material for printing three-dimensional parts with a selective deposition-based additive manufacturing system has a composition having a thermoplastic elastomer (TPE) polymer and a surface modifier. The TPE polymer is polyether block amide (PEBA). The part material is provided in a powder form having a D90/D50 particle size distribution and a D50/D10 particle size distribution each ranging from about 1.00 to about 2.0, wherein the part material is configured for use in the selective deposition-based additive manufacturing system having a layer transfusion assembly for printing the three-dimensional parts in a layer-by-layer manner.

A flexible polyamide film obtained by forming a polyamide including a unit formed from an aliphatic dicarboxylic acid (A1) having 18 or more carbon atoms and/or a unit formed from an aliphatic diamine (B1) having 18 or more carbon atoms, wherein the polyamide has a total content of 10 to 92% by mass of the unit formed from (A1) and the unit formed from (B1), and the film has a melting point of 240° C. or higher.

The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.

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A thermoplastic elastomer composition comprising a blend of (A) thermoplastic materials comprising (A1) a polyamide block copolymer and (A2) one or more thermoplastic organic polymers excluding (A1), with (B) a silicone composition comprising (B1) a silicone base comprising (B1a) a diorganopolysiloxane polymer having a viscosity of at least 1000000 mPa.Math.s at 25° C. and an average of at least 2 alkenyl groups per molecule, (B1b) a reinforcing filler in an amount of from 1 to 50% by weight of polymer (B1a), and (B2) an organohydrido silicone compound which contains an average of at least 2 silicon-bonded hydrogen groups per molecule, (C) a hydrosilylation catalyst, which composition may additionally optionally comprise (D) one or more additives; wherein the weight ratio (A):(B) is in the range 50:50 to 95:5, and wherein component B2 and C being present in an amount sufficient to cure said silicone composition B.

A thermoplastic elastomer composition comprising a blend of (A) thermoplastic materials comprising (A1) a polyamide block copolymer and (A2) one or more thermoplastic organic polymers excluding (A1), with (B) a silicone composition comprising (B1) a silicone base comprising (B1a) a diorganopolysiloxane polymer having a viscosity of at least 1000000 mPa.Math.s at 25° C. and an average of at least 2 alkenyl groups per molecule, (B1b) a reinforcing filler in an amount of from 1 to 50% by weight of polymer (B1a), and (B2) an organohydrido silicone compound which contains an average of at least 2 silicon-bonded hydrogen groups per molecule, (C) a hydrosilylation catalyst, which composition may additionally optionally comprise (D) one or more additives; wherein the weight ratio (A):(B) is in the range 50:50 to 95:5, and wherein component B2 and C being present in an amount sufficient to cure said silicone composition B.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

Provided is a polymer comprising a hydrolysable polymer backbone, the polymer backbone comprising (i) monomer units with a side chain comprising a hydrophobic group; (ii) monomer units with a side chain comprising an oligoamine or polyamine; and optionally (iii) monomer units with a side chain comprising an ionizable group, as well as a method of preparing said polymer, and a method of delivering a nucleic acid and/or polypeptide to a cell using the polymer.

Provided is a polymer comprising a hydrolysable polymer backbone, the polymer backbone comprising (i) monomer units with a side chain comprising a hydrophobic group; (ii) monomer units with a side chain comprising an oligoamine or polyamine; and optionally (iii) monomer units with a side chain comprising an ionizable group, as well as a method of preparing said polymer, and a method of delivering a nucleic acid and/or polypeptide to a cell using the polymer.

It is provided that a biaxially stretched polyamide film that is excellent in oxygen gas barrier property, impact resistance, and bending fatigue resistance, which are film qualities necessary for a packaging film and that is carbon-neutral by using a raw material derived from biomass; and a laminated body using the biaxially stretched polyamide film. A biaxially stretched polyamide film in which a resin layer (layer B) mainly composed of an aliphatic polyamide resin is laminated on at least one surface of a resin layer (layer A) mainly composed of a m-xylylene group-containing-polyamide polymer, wherein the biaxially stretched polyamide film satisfies the following requirements (1) to (3): (1) the resin layer (layer A) contains not lower than 70% by mass of the m-xylylene group-containing-polyamide polymer; (2) the resin layer (layer B) mainly composed of the aliphatic polyamide resin contains at least 99 to 60% by mass of polyamide 6 and 1 to 34% by mass of a polyamide polymerized from a biomass-derived raw material; and (3) a thickness of the layer A is not lower than 10% and not higher than 30% of a total thickness of the layer A and the layer B.