Provided are a modified polybenzoxazole and a modified polybenzoxazole sheet each having small temperature dependence of its modulus of elasticity, each of which may be suitably used for forming a cleaning sheet that may be suitably used for a transfer member to be transferred in a substrate processing apparatus. Also provided is a cleaning sheet having small temperature dependence of its modulus of elasticity, including such modified polybenzoxazole sheet as a cleaning layer. Also provided is a transfer member provided with a cleaning function, including such cleaning sheet and a transfer member. The modified polybenzoxazole is a modified polybenzoxazole, including a benzoxazole ring structure and two or more amide groups, the modified polybenzoxazole having a storage modulus of elasticity at 1 Hz in a range of 0° C. to 100° C. of 200 MPa to 2,000 MPa.

The present invention is a water-dispersible resin composition containing: a resin α that includes, in the main chain thereof, a structure M having two aromatic rings linked by a sulfide group, a sulfonyl group, an imide group, or a keto group; and a resin β having a hydrophilic group, the resins α and β being configured to form a co-continuous structure including three-dimensional continuous phases of the resins α and β. The present invention can provide a water-dispersible resin composition that maintains the heat resistance of the polymer material and can be removed only with water.

Compositions of azobenzene-containing, photomechanically active, copoly(amic acids) and linear copolyimides including an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride are provided; and methods of making the same.

Compositions of azobenzene-containing, photomechanically active, copoly(amic acids) and linear copolyimides including an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride are provided; and methods of making the same.

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

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Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

##STR00001##

Disclosed are polymers with a complex branched structure (star- or tree-shaped) obtainable by polymerizing a bifunctional type AB monomer and/or type AA+BB monomers in the presence of: a) one or more polyamine and/or a polyacid and/or a polyalcohol and/or more generally a compound (such as POSS) having at least three functional groups such as amino, carboxylic acid or hydroxyl functions; b) one or more phosphorus containing molecules reacting with only one reactive group during the polymerization; c) optionally one or more organic acid and/or an amine and/or an alcohol having one or two functional groups.

Disclosed are polymers with a complex branched structure (star- or tree-shaped) obtainable by polymerizing a bifunctional type AB monomer and/or type AA+BB monomers in the presence of: a) one or more polyamine and/or a polyacid and/or a polyalcohol and/or more generally a compound (such as POSS) having at least three functional groups such as amino, carboxylic acid or hydroxyl functions; b) one or more phosphorus containing molecules reacting with only one reactive group during the polymerization; c) optionally one or more organic acid and/or an amine and/or an alcohol having one or two functional groups.

Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R.sup.2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).

A polyamide acid of the present invention contains, as a diamine component, 2,2-bistrifluoromethylbenzidine and trans-1,4-cyclohexanediamine, and contains, as a tetracarboxylic acid dianhydride component, a pyromellitic acid anhydride and a 3,3,4,4-biphenyltetracarboxylic acid dianhydride. A ratio of the trans-1,4-cyclohexanediamine to a total amount of the diamine is preferably 0.5-40 mol %. A polyimide is obtained by dehydration ring closure of the polyamide acid.