A polyarylene sulfide copolymer has a glass transition temperature of 95° C. or higher and 190° C. or lower and has a melting point of 300° C. or lower or does not have a melting point, as measured by differential scanning calorimetry, and the copolymer containing as a structural unit arylene sulfide units having a number average molecular weight (Mn) of 1,000 or more and 10,000 or less. The polyarylene sulfide copolymer can be provided with high physical stability such as in rigidity at high temperature and excellent moldability and chemical resistance.

The present disclosure relates to a composition that includes a first repeat unit defined by ##STR00001##
where R includes a first hydrocarbon chain that includes at least one olefinic bond, R.sub.5 includes a second hydrocarbon chain, the second hydrocarbon chain may be saturated, and n may be between 2 and 1,000.

The present invention is a resin composition, including: a resin α1 having an aromatic dicarboxylic acid monomer unit A1 having a hydrophilic group, a dicarboxylic acid monomer unit B1 having no hydrophilic group, and an aromatic monomer unit C1; and a resin α2 having an aromatic dicarboxylic acid monomer unit A2 having a hydrophilic group, a dicarboxylic acid monomer unit B2 having no hydrophilic group, and an aliphatic monomer unit C2, wherein the resin α2 includes a monomer unit other than a monomer unit that constitutes the resin α1, and a mass ratio of a content of the resin α1 to a content of the resin α2 is 0.9 or more and 20 or less. According to the present invention, a resin composition that can be removed only with water while maintaining the heat resistance of polymer materials can be provided.

The invention relates to a self-retardant copolyesteramide, characterised in that it is obtained by means of polycondensation of at least one polyamide monomer with at least one phosphorus-containing diol. The invention also relates to the use of such a copolyesteramide according to the invention for the manufacture of electrical and/or electrotechnical objects, tubes, cables, electrical safety objects, moulded objects, and/or objects obtained by 3D printing.

The invention discloses an in situ polymerized flame retardant, derived from the following monomers: a diacid monomer A: where A1 is terephthalic acid, A2 is a phosphorus aromatic ring-containing reactive flame-retardant diacid monomer, A1+A2=100 mol %, A1=50 to 90 mol %, A2=10 to 50 mol %; and a diamine monomer B: one or more of diamine monomers containing 4 to 36 carbon atoms. In the present invention, a novel flame retardant is obtained by in situ polymerization of the phosphorus aromatic ring-containing reactive flame-retardant diacid monomers in semi-aromatic polyamide oligomers, which has advantages of no precipitation in the semi-aromatic polyamide and no influence on other properties of the semi-aromatic polyamide and has an excellent flame-retardant property.

The invention discloses an in situ polymerized flame retardant, derived from the following monomers: a diacid monomer A: where A1 is terephthalic acid, A2 is a phosphorus aromatic ring-containing reactive flame-retardant diacid monomer, A1+A2=100 mol %, A1=50 to 90 mol %, A2=10 to 50 mol %; and a diamine monomer B: one or more of diamine monomers containing 4 to 36 carbon atoms. In the present invention, a novel flame retardant is obtained by in situ polymerization of the phosphorus aromatic ring-containing reactive flame-retardant diacid monomers in semi-aromatic polyamide oligomers, which has advantages of no precipitation in the semi-aromatic polyamide and no influence on other properties of the semi-aromatic polyamide and has an excellent flame-retardant property.

The present invention is a soluble material for three-dimensional modeling that is used as a material of a support material for supporting a three-dimensional object when the three-dimensional object is manufactured by a 3D printer of a fused deposition modeling system and that contains a thermoplastic resin having a hydrophilic group and an organic salt compound represented by a general formula (I) below: (R.sup.1—SO.sub.3.sup.−).sub.nX.sup.n+ (I). According to the present invention, it is possible to provide a soluble material for three-dimensional modeling that is used for a support material and that is capable of suppressing the degradation of the modeling accuracy of a three-dimensional object when the three-dimensional object is manufactured by a 3D printer of a fused deposition modeling system, and has a high rate of dissolution to neutral water to be removable speedily from a precursor of the three-dimensional object without use of a strong alkaline aqueous solution.

Provided are a compound represented by formula (Ia) below, a polymer obtained by using the compound as a synthesis raw material, a gas separation membrane having a gas separation layer including the polymer, and a gas separation module and a gas separation apparatus that have the gas separation membrane.

##STR00001##

R.sup.A and R.sup.B represent a hydrogen atom, an alkyl group, or a halogen atom.

L.sup.A represents —CF.sub.2—, —CF(CF.sub.3)—, —C(═O)—, —CH.sub.2—, —CH(CH.sub.3)—, or —CH(CF.sub.3)— or a group obtained by combining the foregoing groups. L.sup.A has 4 or less carbon atoms.

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.

The present disclosure relates to a polymer resin composition including a polyamide resin in which an average particle size of individual crystals measured by a small-angle X-ray scattering apparatus is reduced through an alternating segment structure, and at least one selected from the group consisting of a metal salt compound and an end-capping agent compound, and a polymer film and a resin laminate using the same.