The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide

##STR00001## in which A, B, R.sup.1, R.sup.2, and m have the meaning as defined herein.

The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide

##STR00001## in which A, B, R.sup.1, R.sup.2, and m have the meaning as defined herein.

A liquid crystal polymer composition for a copper substrate with low dielectric constant and low dielectric loss suitable for use in printed circuit boards includes a solvent, a soluble liquid crystal polymer dissolved in the solvent, and a liquid crystal polymer powder dispersed in the solvent. The soluble LCP and the LCP powder form a solid content in the LCP composition. A mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%.

An oligomer or polymer with carbonate segment chemical structure, whose structure is expressed by the formula ##STR00001##
wherein R.sub.1 is a functional group derived from a polyol, a polyester polyol or a polyether polyol. The oligomer or polymer with carbonate segment chemical structure is applicable to automobile manufacturing, wires & cables, and medical equipment.

An oligomer or polymer with carbonate segment chemical structure, whose structure is expressed by the formula ##STR00001##
wherein R.sub.1 is a functional group derived from a polyol, a polyester polyol or a polyether polyol. The oligomer or polymer with carbonate segment chemical structure is applicable to automobile manufacturing, wires & cables, and medical equipment.

The present invention relates to a composition comprising (i) an unsaturated dicarboxylic acid, an ester or an anhydride thereof and (ii) aliphatic diol, (iii) dianhydrohexitol, (iv) cycloaliphatic diol and/or aromatic aliphatic diol, and (v) an amide-forming agent. Further, the invention relates to an unsaturated polyesteretheramide obtainable by condensation of the composition of the invention and to an unsaturated polyesteretheramide resin comprising the unsaturated polyesteretheramide and a reactive diluent. The invention further relates to a thermoset with high thermo-mechanical properties.

The present invention relates to a composition comprising (i) an unsaturated dicarboxylic acid, an ester or an anhydride thereof and (ii) aliphatic diol, (iii) dianhydrohexitol, (iv) cycloaliphatic diol and/or aromatic aliphatic diol, and (v) an amide-forming agent. Further, the invention relates to an unsaturated polyesteretheramide obtainable by condensation of the composition of the invention and to an unsaturated polyesteretheramide resin comprising the unsaturated polyesteretheramide and a reactive diluent. The invention further relates to a thermoset with high thermo-mechanical properties.

The present invention relates to fibers comprising a polyesteramide (PEA) having a chemical formula described by structural formula (IV),

##STR00001##

wherein m+p varies from 0.9-0.1 and q varies from 0.1 to 0.9; m+p+q=1 whereby m or p could be 0; n is about 5 to about 300; (pref. 50-200); R.sub.1 is independently selected from the group consisting of (C.sub.2-C.sub.20) alkylene, (C.sub.2-C.sub.20) alkenylene, —(R.sub.9—CO—O—R.sub.10—O—CO—R.sub.9)—, —CHR.sub.11—O—CO—R.sub.12—COOCR.sub.11—, and combinations thereof; R.sub.3 and R.sub.4 in a single backbone unit m or p, respectively, are independently selected from the group consisting of hydrogen, (C.sub.1-C.sub.6)alkyl, (C.sub.2-C.sub.6)alkenyl, (C.sub.2-C.sub.6)alkynyl, (C.sub.6-C.sub.10)aryl, (C.sub.1-C.sub.6)alkyl, —(CH.sub.2)SH, —(CH.sub.2).sub.2S(CH.sub.3), —CH.sub.2OH, —CH(OH)CH.sub.3, —(CH.sub.2).sub.4NH.sub.3+, —(CH.sub.2).sub.3NHC(═NH.sub.2+)NH.sub.2, —CH.sub.2COOH, —(CH.sub.2)COOH, —CH.sub.2—CO—NH.sub.2, —CH.sub.2CH.sub.2—CO—NH.sub.2, —CH.sub.2H.sub.2COOH, CH.sub.3—CH.sub.2—CH(CH.sub.3)—, (CH.sub.3).sub.2—CH—CH.sub.2—, H.sub.2N—(CH.sub.2).sub.4—, Ph-CH.sub.2—, CH═C—CH.sub.2—, HO-p-Ph-CH.sub.2—, (CH.sub.3).sub.2—CH—, Ph-NH—, NH—(CH.sub.2).sub.3—C—, NH—CH═N—CH═C—CH.sub.2—; R.sub.5 is selected from the group consisting of (C.sub.2-C.sub.20)alkylene, (C.sub.2-C.sub.20)alkenylene, alkyloxy or oligoethyleneglycol; R.sub.6 is selected from bicyclic-fragments of 1,4:3,6-dianhydrohexitols of structural formula (III);

##STR00002## R.sub.7 is selected from the group consisting of (C.sub.6-C.sub.10)aryl(C.sub.1-C.sub.6)alkyl; R.sub.8 is —(CH2)4-; R.sub.9 or R.sub.10 are independently selected from C.sub.2-C.sub.12 alkylene or C.sub.2-C.sub.12 alkenylene; and R.sub.11 or R.sub.12 are independently selected from H, methyl, C.sub.2-C.sub.12 alkylene or C.sub.2-C.sub.12 alkenylene whereby a is at least 0.05 and b is at least 0.05 and a+b=1.