Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s that migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.

A curable resin composition containing a blend of multifunctional benzoxazines, and composite materials derived therefrom. The benzoxazine blend contains the combination of (A) a difunctional benzoxazine component and (B) a multifunctional benzoxazine component with functionality of greater than 2. Cured matrix resins and cured composite materials containing such benzoxazine blend exhibit a significant retardation in the rate of organic solvent uptake as compared to the same cured matrix resins and composite materials without component (B).

A mechanical ball-milling method for preparing a polydopamine-modified montmorillonite nanomaterial is disclosed. The method includes dispersing a montmorillonite material in an aqueous solution, stirring, concentrating and collecting a concentrated montmorillonite solution for use; adding dopamine hydrochloride to a buffer solution to prepare a dopamine hydrochloride solution, with a concentration of 0.2-1 g/mL, and adjusting the pH value of the dopamine hydrochloride solution; and adding the dopamine hydrochloride solution and the concentrated montmorillonite solution simultaneously into a ball mill jar to form a mixture, and then subjecting the mixture to a ball milling for 0.3-6 hours, pouring the mixture out of the ball mill jar, and subjecting to a solid-liquid separation by a centrifugation, and then washing a solid product with deionized water for 3-6 times, and removing water from the solid product, to obtain the polydopamine-modified montmorillonite nanomaterial.

A process for preparing high molecular weight, branched, acyclic polyalkyleneamines comprising transaminating a reaction mixture that includes at least a first polyalkyleneamine component that contains at least two non-tertiary amine groups separated from one another by a ternary or higher carbon atom and a second polyalkyleneamine component having the formula wherein x, y, and z are the same or different and are integers of from 1 to 10; a, b, c, d, e, and f are the same or different and are H or hydrocarbyl of from 1 to 10 carbon atoms; A, B, C, D, E, are the same or different and are H or hydrocarbyl of from 1 to 10 carbon atoms; provided that at least two of the amine groups are primary or secondary. ##STR00001##

A biodegradable electroactive material can be doped with a drug and the drug can be delivered to a living subject by stimulating the material with an electrical potential. The material (in this case a polymer) has an electrochemically responsive oligoaniline block terminated with a carboxylic acid moiety and is linked to an alcohol-terminated diol by an ester bond. Advantageously, the diol is PEG-400, PEG-2000, PCL-530, or PCL-2000.

A cellulose and/or synthetic fibre-based support of which at least one surface is coated with a layer containing at least one water-soluble polymer comprising hydroxyl or primary-secondary amino functional groups, at least some of which have been functionalized beforehand with at least one organic compound comprising at least one epoxy functional group, and at least one R.sup.1 group wherein R.sup.1 is a vinyl functional group or at least one Si(R.sup.2).sub.3 functional group and wherein R.sup.2=hydrogen atom, hydroxyl, alkoxy, alkyl, and combinations thereof.

A curable benzoxazine composition is described wherein the benzoxazine is derived from an aryl amine having a b.p.>200° C. The curable compositions are more thermally stable and have reduced weight loss and by-products upon cure.

The present invention provides guanidine compounds and salts thereof that may be useful, for example, in the preparation of herbicidal compositions. The compounds may be used, for example, to prepare N-phosphonomethylglycine guanidine salts having improved herbicidal efficacy over glyphosate alone.

The embodiments herein relate to a benzoxazine resin composition, a prepreg, and a carbon fiber-reinforced composite material. More specifically, the embodiments herein relate to a benzoxazine resin composition that provides a carbon fiber-reinforced composite material that is suitable for use as a manufacture material due to its superior mechanical strength in extreme use environments, such as high temperature and high moisture, as well as a prepreg, and a carbon fiber-reinforced composite material. An embodiment comprises a benzoxazine resin composition having a multifunctional benzoxazine resin; a multifunctional epoxy resin that is a liquid at 40° C. and has three or more glycidyl groups; a sulfonate ester; and optionally at least one thermoplastic resin. The resin may include an interpenetrating network structure after curing.

A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.