The invention provides a polymerizable composition and a hydrogel obtained or obtainable from the polymerizable composition. The polymerizable composition comprises cucurbituril and a first monomer having a guest for the cucurbituril, wherein the total monomer concentration, C.sub.mon, within the polymerizable composition is at least 0.5 M. The composition may be an aqueous composition.

The invention provides a polymerizable composition and a hydrogel obtained or obtainable from the polymerizable composition. The polymerizable composition comprises cucurbituril and a first monomer having a guest for the cucurbituril, wherein the total monomer concentration, C.sub.mon, within the polymerizable composition is at least 0.5 M. The composition may be an aqueous composition.

A curable resin composition including a first bismaleimide compound, a second bismaleimide compound which is different from the first bismaleimide compound, and a cyanate ester monomer. A liquid processible bismaleimide-triazine resin is provided by curing the resin composition. A method of preparing the liquid processible bismaleimide-triazine resin is also disclosed.

The present disclosure provides a polymerizable thermosetting composition comprising an acetylene-bearing benzoxazine compound and a phthalonitrile monomer. The composition can provide a low viscosity for RTM application and can fully cured at a much lower temperature than the phthalonitrile monomer. The cured thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by formula (25) below,

##STR00001##

wherein R.sup.a represents R.sup.102 or R.sup.103, R.sup.102 represents a fluorine atom or a fluoroalkyl group having 1 to 10 carbon atoms, and R.sup.103 represents a crosslinking group.

Free-standing non-fouling polymers and polymeric compositions, monomers and macromonomers for making the polymers and polymeric compositions, objects made from the polymers and polymeric compositions, and methods for making and using the polymers and polymeric compositions.

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

A thermally activated delayed fluorescent (TADF) deep-red light polymer material is provided, and includes a main chain to polymerize a TADF molecular structure, and a side chain to connect with an alkyl chain. The TADF polymer material of this structure has excellent TADF characteristics and solubility. Further, the material can be used to fabricate an electroluminescent device by a solution processing, and a good device effect can be obtained.