C08G73/06

GRAPHENE-BIOPOLYMER COMPOSITIONS AND METHODS OF MAKING AND USING SAME
20230166975 · 2023-06-01 ·

Provided are printable gel or hydrogel compositions, methods of making printable gel or hydrogel compositions, uses of the printable gel or hydrogel compositions, objects formed from the printable gel or hydrogel compositions, and methods of using those objects. The printable gel or hydrogel compositions may be formed from a graphene component, a polymer component, and a carrier. The printable gel or hydrogel compositions may be used as inks in additive manufacturing techniques to 3D print a 3D object. The 3D object may be freeze-dried to form an aerogel. The aerogel may be used to remove contaminants from aqueous samples.

Coating compositions for use with an overcoated photoresist

Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that comprise that a blend of two or more resins, where one resin has epoxy groups either pendant or fused to the polymer backbone. Preferred coating compositions include: 1) a first resin that comprises one or more epoxy reactive groups; and 2) a crosslinker resin that is distinct from the first resin and comprises epoxy groups.

Polymer, film including the polymer, and display device including the film

A polymer is disclosed, represented by Chemical Formula 1 or Chemical Formula 2: ##STR00001## wherein, in Chemical Formula 1 and Chemical Formula 2, Ar.sup.1, Ar.sup.2, R.sup.3, s, x, and y are defined in the detailed description.

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD

A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).

Highly functional polyamide polymer, spinning dope composition containing same, and molded product thereof
09803054 · 2017-10-31 · ·

Provided are a novel polyamide polymer obtained by polymerizing monomers including aromatic diamine substituted with a nitrile group and an amide group and an aromatic dibasic acid compound, a spinning dope comprising the same, and a polyamide molded article. A fiber obtained using the novel polyamide polymer according to the present invention, particularly, a fiber obtained by spinning the polymer according to the present invention may have high strength and high elasticity, such that the fiber may be applied to various industrial fields.

BENZOXAZINE COMPOUND

Problem to be Solved

One of the objects of the resent invention is to provide a new polybenzoxazine compound that can afford a cured product having excellent toughness, heat resistance and flame retardance without using other components together.

Solution

A benzoxazine compound represented by formula (1):

##STR00001## wherein n is an average repeating number and represents a real number of 1 to 5; R.sub.1 to R.sub.8 each independently represent a hydrogen atom, a halogen atom, an alkyl group having a carbon number of 1 to 8 or an aryl group; when n is 2 or more and the number of each R.sub.3 to R.sub.7 is 2 or more, each R.sub.3 to R.sub.7 may be the same or different; and R.sub.9 represents a residue of a monoamine compound from which an amino group is removed.

POLYMER AND ORGANIC LIGHT-EMITTING DEVICE

A composition comprising a phosphorescent compound of formula (I) and a polymer comprising a repeat unit of formula (II) Ar.sup.1 is an aryl or heteroaryl group. R.sup.2 is a substituent. A is independently in each occurrence N or CR.sup.3 wherein R.sup.3 is H or a substituent. M is a transition metal or metal ion. x is a positive integer of at least 1. y is 0 or a positive integer. L.sup.1 is a mono- or polydentate ligand. R.sup.1 is a substituent. z is 0 or a positive integer. X is O or S. The phosphorescent compound of formula (I) may be mixed with the polymer or may be covalently bound thereto. The composition may be used in the light-emitting layer of an organic light-emitting device.

POLYMER AND ORGANIC LIGHT-EMITTING DEVICE

A composition comprising a phosphorescent compound of formula (I) and a polymer comprising a repeat unit of formula (II) Ar.sup.1 is an aryl or heteroaryl group. R.sup.2 is a substituent. A is independently in each occurrence N or CR.sup.3 wherein R.sup.3 is H or a substituent. M is a transition metal or metal ion. x is a positive integer of at least 1. y is 0 or a positive integer. L.sup.1 is a mono- or polydentate ligand. R.sup.1 is a substituent. z is 0 or a positive integer. X is O or S. The phosphorescent compound of formula (I) may be mixed with the polymer or may be covalently bound thereto. The composition may be used in the light-emitting layer of an organic light-emitting device.

POLYMERIZATION COMPOSITION, POLYMER USING POLYMERIZATION COMPOSITION, AND POLYMER ELECTROLYTE MEMBRANE USING POLYMER

The present specification relates to a polymerization composition, a polymer using the same, a polymer electrolyte membrane using the same, a fuel cell including the same, and a redox flow battery including the same.

Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed Circuit Board Containing the Same
20170298218 · 2017-10-19 ·

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.