Disclosed are methods for making a cured sealant. The methods include depositing an uncured sealant composition on a substrate and exposing the uncured sealant composition to actinic radiation to provide a cured sealant. The uncured sealant composition includes a thiol-terminated polythioether, a polyene comprising a polyvinyl ether and/or a polyallyl compound, and a hydroxy-functional vinyl ether. Related sealant compositions are also disclosed.

According to the present invention, it is possible to provide a polythiol composition, which comprises a polythiol (A) represented by formula (1) and a thiol compound (B) represented by formula (2). ##STR00001##
(In formula (1), p and q each independently represent an integer of 1 to 3.) ##STR00002##
(In formula (2), p and q each independently represent an integer of 1 to 3.)

According to the present invention, it is possible to provide a polythiol composition, which comprises a polythiol (A) represented by formula (1) and a thiol compound (B) represented by formula (2). ##STR00001##
(In formula (1), p and q each independently represent an integer of 1 to 3.) ##STR00002##
(In formula (2), p and q each independently represent an integer of 1 to 3.)

A resist underlayer composition and a method of forming patterns using the resist underlayer composition, the resist underlayer composition including a polymer including a moiety represented by Chemical Formula 1 and a moiety represented by Chemical Formula 2, and a solvent,

##STR00001##

UV-curable glass fiber sizing compositions, glass fibers sized with a UV-curable sizing composition, sizing methods, and composites comprising such UV-curable sized glass fibers are disclosed.

UV-curable glass fiber sizing compositions, glass fibers sized with a UV-curable sizing composition, sizing methods, and composites comprising such UV-curable sized glass fibers are disclosed.

Thiol-terminated polythioether compositions and sealants exhibit an extended working time and rapidly cure at room temperature at the end of the working time are disclosed. The compositions comprise a combination of pyridine catalysts.

Novel and advantageous backplanes, which include a thermoset polymer substrate, are provided. The substrate can be flexible, and the polymer of the substrate can be made by mixing multifunctional thiol monomers and specifically chosen co-monomers. The monomers and co-monomers can undergo a thiol click chemistry reaction to form a low-cure-stress polymer network that can be used as the substrate for an electronics backplane.

Novel and advantageous backplanes, which include a thermoset polymer substrate, are provided. The substrate can be flexible, and the polymer of the substrate can be made by mixing multifunctional thiol monomers and specifically chosen co-monomers. The monomers and co-monomers can undergo a thiol click chemistry reaction to form a low-cure-stress polymer network that can be used as the substrate for an electronics backplane.

Hydroxyl-containing bis(alkenyl) ethers can be incorporated into the backbone of polythioether prepolymers and can be used as curing agents in thiol-terminated polythioether prepolymer compositions. Cured sealants prepared using compositions containing hydroxyl-containing bis(alkenyl) ether-containing polythioether prepolymers and/or hydroxyl-containing bis(alkenyl) ether curing agents exhibit improved physical properties such as rapid curing and compatibility with fillers suitable for use in aerospace sealant applications.