A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer contains a modified silicone and contains ions for ion conduction among the silver particles.

An implantable prosthesis includes a silicone shell having an apex, a base, a radius located between the apex and the base, and a dome extending between the apex and the radius. The silicone shell has an outer surface and an inner surface that surrounds an interior volume of the silicone shell. A silicone gel material is disposed within the interior volume of the silicone shell. A gelling enhancer layer containing a gelling enhancer covers the inner surface of the silicone shell. After the silicone gel material has been thermally cured, the silicone gel material that is located within a zone that is in the vicinity of the gelling enhancer layer has a higher level of cohesiveness than the silicone gel material that is located outside the zone. The gelling enhancer contains crosslinker and/or platinum catalyst, such as a Karstedt catalyst.

An implantable prosthesis includes a silicone shell having an apex, a base, a radius located between the apex and the base, and a dome extending between the apex and the radius. The silicone shell has an outer surface and an inner surface that surrounds an interior volume of the silicone shell. A silicone gel material is disposed within the interior volume of the silicone shell. A gelling enhancer layer containing a gelling enhancer covers the inner surface of the silicone shell. After the silicone gel material has been thermally cured, the silicone gel material that is located within a zone that is in the vicinity of the gelling enhancer layer has a higher level of cohesiveness than the silicone gel material that is located outside the zone. The gelling enhancer contains crosslinker and/or platinum catalyst, such as a Karstedt catalyst.

A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I)

##STR00001##

wherein n is 8 to 232, wherein R.sup.1 is independently C.sub.1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II)

##STR00002##

wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R.sup.2, R.sup.3 and R.sup.4 are independently C.sub.1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III)

##STR00003##

and 90 to 250 parts by mole of a curing agent represented by Formula (IV)

##STR00004##

wherein m is 7 to 230, wherein R.sup.5 is independently C.sub.1-3 alkyl group.

The present invention relates to a composition for peelable-coating-film formation including an elastomer and an amino-modified silicone oil, wherein a film formed from the composition for peelable-coating-film formation has a breaking strength of F.sub.B (N/20 mm) in a tensile test and a coating film formed from the composition for peelable-coating-film formation on a surface of an SUS304 plate has a peel adhesive force of F.sub.G (N/20 mm) in peeling from the SUS304 plate, F.sub.B/F.sub.G being 1.5 or larger.

A thermoplastic resin composition of the present invention is characterized by comprising: a base resin containing a rubber-modified vinyl-based graft copolymer, a large-diameter rubber polymer having an average particle size of about 3 to about 8 μm, and an aromatic vinyl-based copolymer resin; and polyorganosilsesquioxane fine particles having an average particle size of about 0.1 to about 10 μm. The thermoplastic resin composition is excellent in low gloss, weather resistance, and the like.

A thermoplastic resin composition of the present invention is characterized by comprising: a base resin containing a rubber-modified vinyl-based graft copolymer, a large-diameter rubber polymer having an average particle size of about 3 to about 8 μm, and an aromatic vinyl-based copolymer resin; and polyorganosilsesquioxane fine particles having an average particle size of about 0.1 to about 10 μm. The thermoplastic resin composition is excellent in low gloss, weather resistance, and the like.

Articles including durable and icephobic polymeric coatings are disclosed. The polymeric coatings include a bonding layer which may contain a substantially fully cured polymeric resin providing excellent adhesion to metallic or polymer substrates. The polymeric coating further includes an outer surface layer which is smooth, hydrophobic and icephobic and, in addition to a substantially fully cured resin, contains silicone comprising additives near the exposed outer surface. The anisotropic polymeric coatings are particularly suited for strong and lightweight parts required in aerospace, automotive and sporting goods applications. A process for making the articles is disclosed as well.

A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.

A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.