Patent classifications
C08G77/04
ORGANOSILICA MATERIALS, METHODS OF MAKING, AND USES THEREOF
Organosilica materials made from monomers including at least a source of silica that is reactive to polymerize, optionally in combination with at least one additional cyclic monomer. Methods for making such organosilica materials are also described herein.
Method for producing silicone-based adhesive
A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.
Thermally stable and electrically isolating barrier film
A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.
Curable resin composition and optical semiconductor device
A curable resin composition having high transparency in the UV region, UV resistance and heat resistance. The curable resin composition includes an alkoxy oligomer represented by Formula 1 of (R.sup.1R.sup.2R.sup.3SiO.sub.1/2).sub.w(R.sup.4R.sup.5SiO.sub.2/2).sub.x(R.sup.6SiO.sub.3/2).sub.y(SiO.sub.4/2).sub.z and a curing catalyst. The curing catalyst is phosphoric acid present in an amount of 3-30 parts by weight based on 100 parts by weight of the alkoxy oligomer, or alkoxide of at least one metal selected from the group consisting of B, Al, P, Sc, Ga, Y, Zr, Nb, In, Sn, La, Gd, Dy, Yb, Hf, Ta and W, present in an amount of 0.5-20 parts by weight based on 100 parts by weight of the alkoxy oligomer. Each of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 independently represents the same or a different organic group, w, x, y and z are 0 or positive numbers satisfying the relationship of w+x+y+z=1, and the atomic ratio of O/Si is 2.3-3.5.
Curable resin composition and optical semiconductor device
A curable resin composition having high transparency in the UV region, UV resistance and heat resistance. The curable resin composition includes an alkoxy oligomer represented by Formula 1 of (R.sup.1R.sup.2R.sup.3SiO.sub.1/2).sub.w(R.sup.4R.sup.5SiO.sub.2/2).sub.x(R.sup.6SiO.sub.3/2).sub.y(SiO.sub.4/2).sub.z and a curing catalyst. The curing catalyst is phosphoric acid present in an amount of 3-30 parts by weight based on 100 parts by weight of the alkoxy oligomer, or alkoxide of at least one metal selected from the group consisting of B, Al, P, Sc, Ga, Y, Zr, Nb, In, Sn, La, Gd, Dy, Yb, Hf, Ta and W, present in an amount of 0.5-20 parts by weight based on 100 parts by weight of the alkoxy oligomer. Each of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 independently represents the same or a different organic group, w, x, y and z are 0 or positive numbers satisfying the relationship of w+x+y+z=1, and the atomic ratio of O/Si is 2.3-3.5.
Flow cells
An example of a flow cell includes a substrate; a first primer set attached to a first region on the substrate, the first primer set including an un-cleavable first primer and a cleavable second primer; and a second primer set attached to a second region on the substrate, the second primer set including a cleavable first primer and an un-cleavable second primer.
Flow cells
An example of a flow cell includes a substrate; a first primer set attached to a first region on the substrate, the first primer set including an un-cleavable first primer and a cleavable second primer; and a second primer set attached to a second region on the substrate, the second primer set including a cleavable first primer and an un-cleavable second primer.
Multi-site damage sensing and localization soft-matter electronics and related systems and methods
Soft-matter technologies are essential for emerging applications in wearable computing, human-machine interaction, and soft robotics. However, as these technologies gain adoption in society and interact with unstructured environments, material and structure damage becomes inevitable. A robotic material that mimics soft tissues found in biological systems may be used to identify, compute, and respond to damage. This material includes liquid metal droplets dispersed in soft elastomers that rupture when damaged to create electrically conductive pathways that are identified with a soft active-matrix grid. These technologies may be used to autonomously identify damage, calculate severity, and respond to prevent failure within robotic systems.
Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
Methods for plasma depositing polymers comprising cyclic siloxanes and related articles and compositions are generally provided. In some embodiments, the methods comprise flowing a precursor gas in proximity to a substrate within a PECVD reactor, wherein the precursor gas comprises an initiator and at least one monomer comprising a cyclic siloxane and at least two vinyl groups, and depositing a polymer formed from the at least one monomer on the substrate.
CROSS-LINKABLE MASSES BASED ON ORGANOSILICON COMPOUNDS
Crosslinkable compositions, processes for producing the same and products made therefrom. Where the crosslinkable compositions include a component (A) organosilicon compounds having at least two silanol groups and having a viscosity of 10.sup.3 to 10.sup.6 mPas at 25° C., mixtures (M) containing a component (B) of organosilicon compounds of the formula (I) and/or partial hydrolyzates thereof
R.sup.6R.sup.7N—CR.sup.1.sub.2SiR.sub.a(OR.sup.2).sub.3-a (I),
a component (C), selected from (C2) compounds of the formula (III)
R.sup.5OH (III).
The crosslinkable compositions may optionally also include a catalyst (D).