One of purposes of the present invention is to provide an organopolysiloxane that has a low viscosity and allows a cured coating to achieve both high hardness and crack resistance, and provide a composition comprising the organopolysiloxane. An organopolysiloxane represented by the following average unit formula (1) and having a kinetic viscosity of 10 to 350 mm.sup.2/s at 25° C., wherein a proportion (%) of the number of silicon atoms in a unit represented by the following formula (1′) to a total number of silicon atoms in all siloxane units of the organopolysiloxane is 10% or less,

##STR00001##

wherein R.sup.1, R.sup.2, and R.sup.3 are, independently of each other, an unsubstituted or substituted, cyclic or non-cyclic alkyl group having 1 to 12 carbon atoms that may include an ether bond, or an unsubstituted or substituted aryl group having 6 to 12 carbon atoms, R.sup.4 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and a, b, c, d and e are numbers satisfying the equations 0.2≥a≥0, 1≥b>0, 0.75≥c≥0, 0.2≥d≥0 and 1≥e>0, provided that a+b+c+d=1.

One of purposes of the present invention is to provide an organopolysiloxane that has a low viscosity and allows a cured coating to achieve both high hardness and crack resistance, and provide a composition comprising the organopolysiloxane. An organopolysiloxane represented by the following average unit formula (1) and having a kinetic viscosity of 10 to 350 mm.sup.2/s at 25° C., wherein a proportion (%) of the number of silicon atoms in a unit represented by the following formula (1′) to a total number of silicon atoms in all siloxane units of the organopolysiloxane is 10% or less,

##STR00001##

wherein R.sup.1, R.sup.2, and R.sup.3 are, independently of each other, an unsubstituted or substituted, cyclic or non-cyclic alkyl group having 1 to 12 carbon atoms that may include an ether bond, or an unsubstituted or substituted aryl group having 6 to 12 carbon atoms, R.sup.4 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and a, b, c, d and e are numbers satisfying the equations 0.2≥a≥0, 1≥b>0, 0.75≥c≥0, 0.2≥d≥0 and 1≥e>0, provided that a+b+c+d=1.

A polymer composition comprising carbon nanostructures dispersed within a polymer matrix that includes a thermoplastic polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75:2013 at a load of 1.8 MPa and a melting temperature of about 140° C. or more is provided. The carbon nanostructures include carbon nanotubes that are arranged in a network having a web-like morphology and optionally disposed on a substrate.

A polymer composition comprising carbon nanostructures dispersed within a polymer matrix that includes a thermoplastic polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75:2013 at a load of 1.8 MPa and a melting temperature of about 140° C. or more is provided. The carbon nanostructures include carbon nanotubes that are arranged in a network having a web-like morphology and optionally disposed on a substrate.

A wavelength converting includes a diffused-reflecting layer, a substrate, a photoluminescence layer, and a binder. The diffused-reflecting layer has a first surface and a second surface facing away from each other. The substrate is over the first surface of the diffused-reflecting layer. The photoluminescence layer is over the second surface of the diffused-reflecting layer. The binder is mixed at least in the photoluminescence layer or at least in the diffused-reflecting layer, the binder includes a structural unit represented by formula (1), and a characteristic absorption band in a Fourier-Transform Infrared (FTIR) Spectrum of silicon-oxygen-silicon bonds (Si—O—Si bonds) in the binder is from 900 cm.sup.−1 to 1250 cm.sup.−1, ##STR00001##
in which R represents an aromatic group.

A wavelength converting includes a diffused-reflecting layer, a substrate, a photoluminescence layer, and a binder. The diffused-reflecting layer has a first surface and a second surface facing away from each other. The substrate is over the first surface of the diffused-reflecting layer. The photoluminescence layer is over the second surface of the diffused-reflecting layer. The binder is mixed at least in the photoluminescence layer or at least in the diffused-reflecting layer, the binder includes a structural unit represented by formula (1), and a characteristic absorption band in a Fourier-Transform Infrared (FTIR) Spectrum of silicon-oxygen-silicon bonds (Si—O—Si bonds) in the binder is from 900 cm.sup.−1 to 1250 cm.sup.−1, ##STR00001##
in which R represents an aromatic group.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

Provided is an antibacterial liquid with excellent temporal stability in which caking due to sedimentation of solid components does not occur and with which a film capable of stably maintaining antibacterial properties can be formed, in a case of being formed into a film. Also provided are an antibacterial film formed using the antibacterial liquid, and a spray and a cloth including the antibacterial liquid. The antibacterial liquid includes an antibacterial microparticle, a binder, and a solvent, in which the antibacterial microparticle contains a silver-supporting inorganic oxide, the binder includes at least one compound having a siloxane bond, the solvent includes an alcohol and water, the concentration of solid contents is less than 5% by mass with respect to the total mass of the antibacterial liquid, and the content of the compound having a siloxane bond is 60% by mass or more with respect to the total solid content of the antibacterial liquid.

A networked silicone is disclosed. The networked silicone comprises crosslinked strands of hindered organosilicon compounds. A composition for preparing the networked silicone is also disclosed, and comprises (A) a hindered organosilicon compound, (B) a crosslinking compound, and optionally (C) a catalyst. Additionally, a method of preparing the networked silicone is disclosed, and comprises reacting the hindered organosilicon compound (A) and the crosslinking compound (B), optionally in the presence of the catalyst (C), to give the networked silicone. A reaction product comprising the networked silicone is also disclosed. The reaction product is prepared from the composition and/or in accordance with the method, and may be a cured product. Additionally, a composite article and a method of forming the same are disclosed. The composite article is formed by disposing a networked silicone composition on the substrate and curing the networked silicone composition, thereby preparing the composite article.