Provided is a boron nitride powder having excellent adhesion to a resin. The boron nitride powder has a hexagonal structure, has a carboxyl group present on a surface of the boron nitride powder, and has a molar ratio of carboxyl group to nitrogen atom of 0.001 or more on a surface of the boron nitride powder.

The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

The present invention relates generally to compositions comprising silicone droplets dispersed in an aqueous phase and in particular to cosmetic compositions comprising silicone droplets dispersed in an aqueous phase.

The present invention relates generally to compositions comprising silicone droplets dispersed in an aqueous phase and in particular to cosmetic compositions comprising silicone droplets dispersed in an aqueous phase.

Provided is a flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. Also provided is a flame retardant heat insulator including such flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (A), wherein the resin composition (A) contains: a binder resin; a low-melting point inorganic substance; a high-melting point inorganic substance; and voids. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (B), wherein the resin composition (B) contains: a binder resin that produces a high-melting point inorganic substance when heated; a low-melting point inorganic substance; and voids and/or a void-forming agent.

Provided is a flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. Also provided is a flame retardant heat insulator including such flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (A), wherein the resin composition (A) contains: a binder resin; a low-melting point inorganic substance; a high-melting point inorganic substance; and voids. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (B), wherein the resin composition (B) contains: a binder resin that produces a high-melting point inorganic substance when heated; a low-melting point inorganic substance; and voids and/or a void-forming agent.

The present disclosure relates to a UV- and heat-curable ladder-like polysilsesquioxane copolymer and a method for preparing the same. Since a controlled functionality can be provided only on a desired region via a thiol-ene click reaction without an additional additive, an insulating layer having a low dielectric constant and a microcircuit pattern can be formed without an additional etching process.

The present disclosure relates to compositions comprising a copolymer derived from a vinyl aromatic monomer, a (meth)acrylate monomer, an acid monomer, and a copolymerizable surfactant and compositions comprising the same. The (meth)acrylate monomer can be selected from a monomer having a theoretical glass transition temperature (Tg) for its corresponding homopolymer of 0° C. or less or a hydrophobic (meth)acrylate monomer. In some embodiments, the copolymer is further derived from an organosilane. The copolymers can have a theoretical glass transition temperature (Tg) from −60° C. to 80° C. and a number average particle size of 250 nm or less. The compositions can be used to prepare compositions such as coatings that have improved water resistance, blush resistance, and/or resistance to hydrostatic pressures. Methods of making the copolymers are also provided.

The present disclosure relates to compositions comprising a copolymer derived from a vinyl aromatic monomer, a (meth)acrylate monomer, an acid monomer, and a copolymerizable surfactant and compositions comprising the same. The (meth)acrylate monomer can be selected from a monomer having a theoretical glass transition temperature (Tg) for its corresponding homopolymer of 0° C. or less or a hydrophobic (meth)acrylate monomer. In some embodiments, the copolymer is further derived from an organosilane. The copolymers can have a theoretical glass transition temperature (Tg) from −60° C. to 80° C. and a number average particle size of 250 nm or less. The compositions can be used to prepare compositions such as coatings that have improved water resistance, blush resistance, and/or resistance to hydrostatic pressures. Methods of making the copolymers are also provided.

Examples include a device including a nanovoided polymer element having a first surface and a second surface, a first plurality of electrodes disposed on the first surface, a second plurality of electrodes disposed on the second surface, and a control circuit configured to apply an electrical potential between one or more of the first plurality of electrodes and one or more of the second plurality of electrodes to induce a physical deformation of the nanovoided polymer element.

Examples include a device including a nanovoided polymer element having a first surface and a second surface, a first plurality of electrodes disposed on the first surface, a second plurality of electrodes disposed on the second surface, and a control circuit configured to apply an electrical potential between one or more of the first plurality of electrodes and one or more of the second plurality of electrodes to induce a physical deformation of the nanovoided polymer element.