The present disclosure relates to a stretchable adhesive film comprising a substrate layer comprising an elastomer; and a first adhesive layer provided on one surface of the substrate layer, wherein the stretchable adhesive film satisfies Equation 1, and a display device comprising the same.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

A resin composition containing a polyvinyl alcohol-based resin, 0.1% by mass or more and 1.2% by mass or less of a surfactant, and at least any one of an inorganic filler and silicone particles, wherein the resin composition is free of a plasticizer or comprises 5.0% by mass or less of a plasticizer, and satisfies at least any one of the following requirements (1) and (2). (1) The content of the inorganic filler is 1% by mass or more and 30% by mass or less (2) The content of the silicone particles is 0.01% by mass or more and 0.45% by mass or less

A resin composition containing a polyvinyl alcohol-based resin, 0.1% by mass or more and 1.2% by mass or less of a surfactant, and at least any one of an inorganic filler and silicone particles, wherein the resin composition is free of a plasticizer or comprises 5.0% by mass or less of a plasticizer, and satisfies at least any one of the following requirements (1) and (2). (1) The content of the inorganic filler is 1% by mass or more and 30% by mass or less (2) The content of the silicone particles is 0.01% by mass or more and 0.45% by mass or less

A process for forming a coating on a substrate including atomizing a formulation and applying the formulation to a substrate to form a coating on a substrate.

A thermally conductive silicone composition contains a silicone component (A) and a tetradecahedral filler (B1).

A thermally conductive silicone composition contains a silicone component (A) and a tetradecahedral filler (B1).

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 18 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, or a hydrocarbon group having an alkoxysilyl group, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 10 to 1000 mm.sup.2/s and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has a low slurry viscosity and achieves high extrudability and high moldability, and a method for producing the thermally conductive silicone composition.